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期刊论文
Microstrucmral characteristics of Au/A1 bonded interfaces
Materials Charactriazation (2006), 1 ~5,-0001,():
Fracture characterislics at the interface of ultrasonic bonds between Au and AI were characterized by SEM following pull lesting to effccl separation of the bonded joints. Vertical seclions at Ibe bonding point weir produced by ion-sputter thinning, alld were examined by TEM. Results show Ihat the Ibiekness of the Au/AI atomic diffusion intcrfacc was about 5O0mn due to combined effccts of ultrasonic and thennal energy. Ultrasonic vibration activates dislocations in tile crystallinc latliee and increases alomic diffusion. The fracture morphology on the lift off inlerface was dimpled rapture. Tensile fracture occurred during lbe pull test not al the bonded interface but in die base maleftal: the bond strength at the interlace was enbanced by the diffnsion reactions that occu~ed across the intert~cc due to tile combined ultrasonic and thermal energy
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