钝化层与器件可靠性研究
首发时间:2007-08-27
摘要:本文采用了X光电子能谱仪(XPS)、扫描电镜、二次离子质谱仪(SIMS)等多种分析手段对某半导体器件厂失效器件进行失效原因分析,并与国内外的同类产品进行了对比,通过大量的实验和数据分析,查明器件失效的主要因素是芯片表面的氮化硅钝化层存在缺陷。同时,总结出单一使用XPS测试手段表征钝化层质量的方法。由于这种手段具有信息全面、方便快捷的优势。它不仅可以分析样品的元素和相对含量,还可以通过分析元素的结合能而得到元素的价态信息,并可以进行深度剖析;对于大多数样品都不需要特殊的处理,对样品导电性也没有要求。因此,可以全面的表征氮化硅钝化层质量。
关键词: XPS 氮化硅 钝化层 失效分析
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Study of Passivation layer and Dependability of semiconductor device
Abstract:This paper analyses the cause of the failure device of one semiconductor device factory with XPS, SEM, SIMS etc. analysis means, and compares to like products in and abroad. By in plenty of experiments and data analysis, we find the major factor of device failure is that there are some defects in the passivation layer of SiN on the surface of chip. At the mean time, generalize the method of attribute the quality of passivation layer by XPS test singly. Due to the method with enough information and convenience and quickly, it can not only analyse the elements of sample and the relative content ,but also obtain the valent of element and even the profile analysis. XPS can test most samples without special treatment and conductivity. Therefore, it can attribute quality of passivation layer of SiN.
Keywords: XPS Passivation layer Dependability Analysis of invalidation
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No.1470813730311882****
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