Ni-TiO2复合沉积过程动力学分析
首发时间:2008-07-15
摘要:本文借助电化学方法,通过循环伏安、计时安培和交流阻抗测试,研究了Ni-TiO2复合体系电结晶初期沉积行为,并辅以纯镍体系作对比,来研究TiO2粉体的影响。试验结果表明:在低负电位下,Ni-TiO2复合体系初期形核倾向BFT连续成核模型,在高负电位下,则转变为三维SH瞬时成核模型;TiO2粉体的引入导致镍形核过电位正移以及形核弛豫时间显著减小,促进了镍沉积形核。
关键词: Ni-TiO2复合体系 电沉积 弛豫时间
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Ni- TiO2 compound process of deposition dynamics analysis
Abstract:This paper with the aid of the electro-chemical means ,through the cyclic voltammetry, chronoamperometry and electrochemical impedance spectroscopy test, the electro-deposition behaviors of Ni-TiO2 system were studied .Besides, auxiliary makes the contrast by the pure nickel system,study the influence of TiO2 powder . The results show ,in the case of lower electroplating negative potential, the co-deposition of Ni- TiO2 film follows a 3D progressive nucleation/growth mechanism. While in the case of higher electroplating negative potential, it follows a 3D instantaneous nucleation/growth mechanism; The addition of the TiO2 powder, the nucleation potential of Ni turns to positive direction, and the nucleation relaxation time tm decreases clearly.
Keywords: Ni-TiO2 co-deposition Electro-deposition Relaxation time
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No.2286226012412160****
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Ni-TiO2复合沉积过程动力学分析
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