Monte Carlo Simulation Study of SEM Images of Rough Surfaces
首发时间:2009-01-06
Abstract:In this paper, we have developed a Monte Carlo (MC) simulation method for scanning electron microscopy (SEM) images of rough surfaces. The roughness structure is constructed in a finite element triangulated mesh by using a Gaussian function to describe the distribution of amplitude of the random rough peaks. Further spatial subdividing can accelerate the calculation and improves MC simulation efficiency. The MC model is based on the using of the Mott cross section for description of the electron elastic scattering and the using of the full Penn algorithm in a dielectric functional approach to the electron inelastic scattering. This simulation relates directly a defined rough surface structure described by exact values of roughness parameters with the contrast observed in a SEM image, enabling the investigation of the influence of line edge roughness to the critical dimension (CD) metrology of MOS device by SEM. Example calculation of line images with sidewall roughness demonstrates that the present MC simulation method is useful for CD metrology of nanostructures by CD-SEM and, especially, for the linewidth measurement in the IC industry.
keywords: Monte Carlo CDSEM Rough Surfaces
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Monte Carlo Simulation Study of SEM Images of Rough Surfaces
摘要:In this paper, we have developed a Monte Carlo (MC) simulation method for scanning electron microscopy (SEM) images of rough surfaces. The roughness structure is constructed in a finite element triangulated mesh by using a Gaussian function to describe the distribution of amplitude of the random rough peaks. Further spatial subdividing can accelerate the calculation and improves MC simulation efficiency. The MC model is based on the using of the Mott cross section for description of the electron elastic scattering and the using of the full Penn algorithm in a dielectric functional approach to the electron inelastic scattering. This simulation relates directly a defined rough surface structure described by exact values of roughness parameters with the contrast observed in a SEM image, enabling the investigation of the influence of line edge roughness to the critical dimension (CD) metrology of MOS device by SEM. Example calculation of line images with sidewall roughness demonstrates that the present MC simulation method is useful for CD metrology of nanostructures by CD-SEM and, especially, for the linewidth measurement in the IC industry.
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