单晶铜切削过程中亚表层损伤的分子动力学模拟
首发时间:2011-01-27
摘要:本文采用分子动力学的方法模拟研究了纳米晶铜工件在不同切削速度下的晶体结构形变行为。在慢速切削下,平行于刀具前进方向的工件原子产生了明显的局域位错,工件原子的晶体结构保持了相对的完整性。在快速切削下,刀具冲击做功使切削下的表面原子产生局域熔化状态。然而,由于刀具的切削面相对于工件原子较小,刀具冲击产生的局域热能容易传递,从而使纳米切削后的工件更容易经历一个重结晶的过程。径向分布函数对短程和长程有序性的分析进一步说明了工件原子在不同切削速度下的晶格有序性。
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Molecular dynamics simulation of the metallic surface damage of the single crystal copper in the cutting process
Abstract:In this paper, molecular dynamics simulations are used to study the deformation behaviors and crystalline characters of nanocrystalline copper under different cutting rates of the tool. In the slow cutting rate, a significant local atomic dislocation appears in the forward direction parallel to the tool, and the crystal structure of the workpiece atoms remained relatively order. Under the fast cutting rate, surface atoms subjected to cutting are in localized melted state. However, localized heat generated by cutting is easy to dispersion because of the small ratio of the cutting tool to the workpiece atoms. So the workpiece under cutting is easier to a recrystallization process. Radial distribution function is used to analyze the short-and long-range order of the workpiece atoms under different cutting rates.
Keywords: cutting theory molecular dynamics simulation nanocrystalline copper
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