柱形铜凸点在电热耦合场中的原子迁移行为
首发时间:2011-08-03
摘要:从电场理论和热动力学理论出发,研究了电热耦合场中柱形铜凸点的原子迁移失效的形成过程,并运用ANSYS软件建立了有限元分析模型,对电迁移和热迁移做了定性和定量分析,揭示了柱形铜凸点在电热耦合作用下的失效机理。该研究对IC封装的原子迁移可靠性的改善提供了理论指导。
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Research on atomic migration of Cu-Pillar bumps in electric and thermal fields
Abstract:In order to investigate the evolvement of atomic migration in the coupled electric and thermal fields via electric filed theory and thermal dynamic theory. The ANSYS acting as finite element analysis tool is used to study the electro-migration and thermo-migration qualitatively and quantitatively, and it also reveals the underlying failure mechanism in the coupled electric and thermal fields. The results can be used as a theoretical guideline to improve the reliability of atomic migration for the IC packaging industry.
Keywords: IC packaging Cu-Pillar bump atomic migration finite element method
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