新型抑菌Cu2+超滤膜的制备及性能表征
首发时间:2012-06-21
摘要:近年来,静电自组装技术逐渐成为分离膜改性的核心技术。本文以此为基础,首先将聚乙烯亚胺(PEI)通过静电作用自组装于聚丙烯腈(PAN)多孔基膜表面,形成高分子聚电解质层;进一步通过浸泡法和动态电沉积法,将Cu2+固载于高分子聚电解质层上,制备出新型Cu2+固载超滤膜,以提高膜的抑菌性能。研究结果表明,Cu2+固载超滤膜的PEI层和Cu2+均具有较高稳定性;该分离膜在保证良好分离性能的同时,具有优良的抑菌性能。此外,相对于静态浸泡法,动态电沉积法是一种更有效的Cu2+固载手段,不仅大幅缩短固载时间,还显著提高Cu2+固载率。期待以上所研制的Cu2+固载超滤膜能够为抑菌型分离膜的制备开辟新途径,并进一步扩大在水处理领域中的应用。
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Preparation and Characterization of a Novel anti-biofouling Ultrafiltration Membrane with Cu2+ Immobilization
Abstract:In recent years, the electrostatic self-assembly method has been becoming the core technology for membrane modification. Based on this technology, polyethylenimine (PEI) polyelectrolyte layer was firstly formed on a polyacrylonitrile(PAN) substrate. Copper(II) ions were immobilized onto the PEI layer via static immersion method and dynamic electro-deposition method respectively. Finally, a novel ultrafiltration membrane with Cu2+ immobilization was obtained. The results indicated that the PEI layer and Cu2+ of the membrane had high stability. This novel membrane had a good separation performance, at the same time, yielded a excellent bacteriostatic property. In addition, compared with static immersion method, dynamic electro-deposition method was a much more effective method for immobilizing Cu2+. These novel membranes not only reduced the Cu2+ immobilization time, also increased the Cu2+ immobilization rate significantly. Looking forward to these novel anti-biofouling ultrafiltration membranes with Cu2+ immobilization could open a new avenue for the preparation of bacteriostatic-type membranes and expand the application in water treatments.
Keywords: Ultrafiltration membrane Polyethylenimine Electro-deposition Copper(Ⅱ) immobilization Bacteriostasis
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