FEM模拟电镀银体系阴极电流密度分布
首发时间:2014-03-28
摘要:无氰电镀银工艺具有电镀槽体积小、镀液粘度大、传质要求高等特点,电镀微小零件过程中容易出现表面电沉积层均一度不同的问题。明确阴极电流密度分布的影响因素,可以为零件的摆放提供理论指导。本文运用有限单元法(Finite Element Method,FEM),结合传统的电化学测试,研究了单纯电场作用下工作电极排布方式和电极尺寸对阴极电流密度分布的影响。随着阵列电极直径的增大,阴极电流密度变小。正多边形排布的阵列电极的电流密度分布最为均匀。以其他形式排布时,越靠近几何中心的电极的电流密度越大。在几何形状相同的排布情况下,排布越紧密,电极的电流密度越大。
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Simulation by FEM on distribution of cathodic current density in silver electrodeposition system
Abstract:Cyanide-free silver plating process has some characteristics such as using small electroplating bath, high bath viscosity, and high mass transfer requirments which cause surface uniformity of the deposits is not good when plating small workpieces. Define the factors affecting the cathodic current density distribution can provide theoretical guidance for the placement of the small workpieces. Finite Element Method (FEM) was applied to study the effect of the working electrode arrangement and sizes of the electrodes on current density distribution in a simple electric field combining traditional electrochemical measurements. With the increase of the electrode array diameter, the electrode current density decreases. Polygon arranged electrode arrays have the most uniform current density distribution. When electrode arrays arranged in other forms, the electrode that is near the array geometric center has the bigger current density. When the geometry of the arrangements are same, the closely arrangement causes a bigger current density on the electrode.
Keywords: applied chemistry array of electrodes current density distribution FEM
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