烧结工艺对PCD性能的影响
首发时间:2014-09-09
摘要:通过正交试验确定PCD烧结工艺,烧结温度1550℃、烧结时间180s、冷却时间40s,合成压力5.7±0.1GPa为最优。为了验证实验结果的准确性,在此优化条件工艺参数条件下,我们进行了超细PCD材料的高压高温烧结实验,并对样品的微结构进行分析。实验结果表明该烧结工艺较佳,基本上制备出整体性能均匀细粒度的PCD材料。
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The effect of sintering process on PCD material
Abstract:PCD sintering process is determined by orthogonal, it is the best sintering parameters when the sintering temperature is 1550℃, the sintering time is 180s, the cooling time is 40s, and the synthesis pressure is 5.7±0.1Gpa. In order to verify the accuracy of the experimental results, we conducted a high pressure and high temperature sintering tests of ultrafine PCD material under optimum conditions of the process parameters, and the microstructure of samples were also analyzed. Experimental results indicate that the sintering process is preferably; the PCD material of uniform property and fine-grained is sintered basically.
Keywords: Polycrystalline diamond(PCD) sintering process microstructure
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