盐酸/双氧水刻蚀铜表面摩擦学性能研究
首发时间:2014-10-30
摘要:本文通过简单的化学刻蚀法在金属铜表面构筑起一层CuCl微纳结构,并进一步在CuCl表面沉积硬脂酸薄膜。采用扫描电镜,X射线衍射仪,傅里叶红外光谱仪和接触角测量仪等表征金属铜表面结构的形貌和形成机制,并使用微纳米摩擦磨损试验机表征金属铜表面结构的摩擦学特性。研究表明:的在相同的实验条件下,CuCl微纳结构能够使铜表面的摩擦系数由0.67降低到0.37,磨痕宽度由200um减小到125um;而在CuCl表面沉积硬脂酸薄膜更能使其摩擦系数降低到0.1且磨痕宽度保持在120um左右,显示出优良的摩擦学特性。
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Friction and wear behaviour of etched surface of Cu by hydrochloric acid /perhydrol solution
Abstract:In this paper, the CuCl micro-nano structure on Cu substrate was fabricated by a simple chemical etching process. Then, CuCl film can be further modified by deposited stearic acid film. Scanning electron microscopy, X-ray diffraction, FI-IR Microscope and water contact angle measurement instrument has been performed the morphological feature of the copper surface structure, chemical composition and formation mechanism. The tribological properties of modified copper surface is tested by micro tribotester. The results show that CuCl micro-nano structure can reduce the friction coefficient of copper from 0.67 to 0.37, with the worn scar width decreasing from 200um to 125um. The stearic acid film on the CuCl can further decrease the friction coefficient to 0.1, showing excellent tribological properties.
Keywords: Friction copper;chemical etch CuCl film Stearic acid
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No.4615037100796914****
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