基于功能细分的TSV冗余策略
首发时间:2014-11-21
摘要:硅通孔(Through Silicon Via, TSV)技术是现今主流的三维(3D)芯片上下层互联技术之一,并会影响整个芯片的成品率。鉴于此,本文将从3D 片上网络(NoC)垂直通道的功能细分入手:按照TSV重要性的不同划分成组,对不同的TSV组配置不同的冗余配置比。在PCC平台上完成的实验显示,虽然面积开销增加了60%以上,但该冗余容错方案保证了在TSV总数达到十万量级时,依然高达99.9999%以上的成品率,也通过功能细分策略,尽可能地减小了面积开销。
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TSV Redundant Strategy Based on Functional Segmentation
Abstract:Through silicon via (TSV) technology is the mainstream of interconnection technology on 3-D stacked chips, and low TSVs yields significantly affect 3-D chip yields. In view of this, this article will implement a fault-tolerance scheme based on functional segmentation for vertical channel on 3-D chips: according to the difference of importance of TSVs, we divide these TSVs into groups and configure different redundant proportion. The relevant experiments on PCC platform have shown that although the area overhead increase by more than 60%, but the fault-tolerant scheme achieves a target yield of 99.9999% when the number of TSVs reaches hundred thousand of magnitude, and obviously, this strategy based on functional segmentation is able to reduce the area overhead as much as possible.
Keywords: TSV Fault Tolerance Functional Segmentation Yield
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