化学机械抛光中晶圆/抛光垫表面接触分析
首发时间:2014-11-05
摘要:基于接触力学和流体动力学理论分析了抛光过程中的摩擦学行为,建立了简化的化学机械抛光过程中的有限元模型。通过工艺参数、材料参数、抛光液性能等参数的改变,得到晶圆表面接触应力、接触应力变化率、VonMises应力的分布规律。分析了工艺参数和材料性能对晶圆表面材料去除非均匀性的影响。
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Surface Contract Analysis Between Wafer and Polishing Pad During Chemical Mechanical Polishing
Abstract:Based on contact mechanics and hydrodynamics, tribology principle during planarization was analyzed. Simplified finite element model was established. Distribution of wafer surface contact stress, change ratio of contact stress and Von Mises stresses can be got during different process parameter, materials parameter and slurry character. The effects of applied down pressure, pad properties, status of slurry on the non-uniformity of the wafer surface can be readily evaluated.
Keywords: chemical mechanical polishing contract analysis finite element method
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No.4616024944847141****
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