电镀金刚石盘抛光CVD金刚石膜的工艺研究
首发时间:2017-05-19
摘要:CVD金刚石具有优良的物理化学特性被应用于刀具、光学、热学和半导体领域。但由于生长机理的限制,CVD金刚石表面比较粗糙,必须通过抛光才能得以应用。本研究采用电镀金刚石盘实现CVD金刚石的快速抛光。结果表明:随着电镀金刚石盘粒径的减小,材料去除率急剧减小。300#电镀金刚石盘能够获得1.75mg/h的材料去除率,而1500#电镀金刚石盘材料去除率接近于零。随着抛光盘转速的增加,材料去除率增加。当压力高于40N时,材料去除率增加的不明显。经过不断减小抛光盘的粒径,可以获得表面粗糙度约为Ra20nm的金刚石表面。经过拉曼光谱分析得出,金刚石是在机械作用和石墨化两种方式去除。试验所提出的固结电镀金刚石盘的方法能够快速实现CVD金刚石的抛光。
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Polishing Technique of CVD Diamond Film with Electroplated Diamond Plate
Abstract:CVD diamond possesses wide appilcations in fields of tool, optical, heat spread and semiconductor because of its good physical and chemical properties. However, CVD diamond has very rough surface being limited by growing mechanism. So in this paper electroplated diamond plate was used to polish CVD diamond efficiently. The results shows that, the material removal rate drop dramatically with the grain size of eletroplated diamond plate. The 300# eletroplated diamond plate can achieve a removal rate of about 1.75mg/h, while the material removal rate woth 1500# eletroplated diamond plate is nearly zero. Also, the material removal rate will increase with the speed of polishing plate and when the polishing pressure is larger than 40N the material removal rate has slightly increase. the Roman spectroscopy analysis shows diamond is removed by the combination of mechanical action and graphitization. This method can remove diamond rough asperities efficiently.
Keywords: CVD diamond Electroplated diamond plate Polishing Technique
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