铝垫工艺pits缺陷的形成机理和改善研究
首发时间:2017-09-22
摘要:在集成电路制造中,Al具有在空气中稳定,且其工艺廉价和成熟的特点。这使其在90纳米甚至更微小尺寸的工艺技术的远后段制程中必不可少。作为电路外连的接口, Al pad表面如果存在pits缺陷,将影响晶圆出货和后续封装。本文主要研究了Al pad上pits缺陷形成的原因和解决方法。通过对Al沉积、钝化层干刻、钝化层湿法清洗、干刻后O2处理等工艺的逐步研究,确定湿法药液NE111和纯水的循环次数为主要影响因素。减少循环次数可以有效避免pits缺陷,并通过长达3个月的存放确认减少循环次数没有带来负面效果。
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Study on formation mechanism and improvement of Al pad pits defect
Abstract:In IC manufacturing, Aluminum (Al) is widely used because it is stable in air and Al process is mature and cheap, which make it essential in the below 90nm process technology. Al pad is the interface of the external connection of the circuit, so delivery and subsequent encapsulation of wafers can be affected if the pits exist in it. This paper mainly studies the theory of pits formation in Al pad and how to solve it. The cycle times of NE111 and water in wet process were considered the main factor of pits formation by the gradual studies of Al deposition, passivation layer etching, passivation layer wet cleaning, and post-etching of O2 treatment. Reducing the number of cycles can effectively avoid the pits, and it is confirmed through 3-month storage.???
Keywords: IC manufacturing Al process pits defect
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