IGBT模块焊料层故障易发部位探究
首发时间:2018-04-08
摘要:IGBT功率模块作为开关器件,不断地通断操作,使其经受温度和应力的反复冲击,模块的性能将不断退化,使其可靠性逐渐降低。针对IGBT的可靠性,通过仿真探究的方法,分析了模块在运行过程中焊料层的温度与热应力分布,并研究得出较易发生焊料层故障的部位,从而对模块退化情况的分析评估提供了一种有效的方法,对于IGBT模块的安全可靠性运行具有重要意义。
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Research on Faulty Parts of Solder Layer in IGBT Module
Abstract:IGBT power module as a switching device, constantly on-off operation makes it undergoes repeated impact of temperature and stress, the performance of the module will continue to degrade, so that its reliability is gradually reduced. According to the reliability of IGBT, the temperature and thermal stress distribution of the solder layer during the operation of the module are analyzed by simulation and the parts of the solder layer which are more prone to failure are obtained. An effective method for the analysis and evaluation of the degradation of the module is provided, which is of great significance for the safe and reliable operation of the IGBT module.
Keywords: IGBT power module reliability solder layer
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