一种扫描测试及自动测试向量生成方法
首发时间:2018-08-28
摘要:随着集成电路在可穿戴设备、物联网、医疗、工业控制、无人驾驶等方面的应用的飞速发展,对各类传感器、电源管理芯片的需求与日俱增。这类芯片的引脚数目往往比较少以降低封装成本,但给芯片的制造缺陷测试带来了诸多挑战。由于引脚数目的限制,这类芯片通常无法基于标准的JTAG协议来实现测试,导致芯片的测试变得复杂。针对这一问题,本文通过研究TetraMAX ATPG生成的STIL格式测试文件和测试流程,提出一种基于两根信号的扫描测试方法及与之相应的自动测试向量生成方法。最后,通过在温度传感器芯片上的具体实施安例,验证了这一方法的可行性。论文还对提出的测试方法所引入的额外芯片面积成本和测试时间成本进行了分析。
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A Scan Test Method and a Method Thereof for Automatically Generating Test Patterns
Abstract:With the rapid development of integrated circuits in wearable devices, Internet of Things, medical, industrial control, and unmanned driving, the demand for various types of sensors and power management chips is increasing. Such chips tend to have fewer pins to reduce packaging costs, but present many challenges for chip manufacturing defect testing. Due to the limited number of pins, such chips are often not capable of testing based on the standard JTAG protocol, which complicates the testing of the chip. Aiming at this problem, this paper proposes a scan test method based on two signals and a corresponding automatic test vector generation method by studying the STIL format test file and test flow generated by TetraMAX ATPG. Finally, the feasibility of this method is verified by the specific implementation of the temperature sensor chip. The paper also analyzes the additional chip area cost and test time cost introduced by the proposed test.
Keywords: Scan Test Test Protocol Automatic Test Vector Generation Chip Test
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