一种优化的冗余金属填充方法
首发时间:2018-09-20
摘要:随着集成电路制造技术的不断发展,刻蚀、化学机械研磨等工艺对于图形密度、图形梯度等指标变得越来越敏感,这也对冗余金属图形的填充提出了更高的要求,需要在尽可能少地影响RC延迟的情况下,提高图形的均匀性。本文通过引入图形匹配技术,结合基于规则的冗余金属填充和基于窗格的冗余金属填充,验证了一种新的冗余金属填充方法,克服了两种填充方法的缺点,有效地提升了图形均匀性。
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A Optimized Method of Dummy Metal Insertion
Abstract:With the development of semiconductor manufactory, process such as ETCH/CMP is more and more sensitive to the pattern density and pattern gradient. Dummy metal insertion is required to improve the pattern uniformity while keep RC delay within the limitation. In this paper, pattern match technology, combined with rule based dummy metal insertion and smart dummy insertion, is used to introduce one new flow to improve the pattern uniformity without any side effect.
Keywords: Dummy metal insertion Pattern density Pattern gradient Pattern match
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