碳化硅氮离子注入模拟研究
首发时间:2019-05-06
摘要:利用SRIM软件模拟了在不同注入角度、注入能量和注入剂量的条件下,N离子在SiC材料中的分布。根据对模拟结果分析发现,随着注入角度的增大,N离子的分布峰位向注入界面处移动且分布峰值减小;N离子注入深度和浓度分别与注入能量和注入剂量近似呈线性关系。经过对注入次数和各次具体N离子注入条件进行了模拟研究,使用多次注入并结合末次大角度注入的方法在500nm的SiC注入区域内实现较为均匀的N离子浓度分布。
关键词: 微电子学与固体电子学 SRIM软件 SiC 多次注入 均匀分布
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Simulation study of N ion implantation in SiC
Abstract:SRIM software was used to simulate the distribution of N ions in SiC materials at different implantation angles, energy and doses. According to the simulation results, it is found that the distribution peak position of N ion moves towards the implantation interface and decreases with the increase of implantation angle, and the depth and concentration of N ion implantation are approximately linear with the implantation energy and dose, respectively. The number of implantations and the specific conditions of each N ion implantation were simulated. The uniform distribution of N ion concentration in the 500 nm SiC implantation area was achieved by multiple implantation combined with the last large angle implantation.
Keywords: Microelectronics and Solid-State Electronics SRIM SiC multiple implantation uniform distribution
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