A manufacturing method of metal wrapping of stepped blind groove for multilayer microwave board

• 1、Anhui Sun-Create Electronics Corporation Limited

Abstract：In the stepped blind groove structure of multilayer microwave circuit board, metal wrapping is very difficult to make to connect outer layer with inter layer at the bottom of blind groove. The original manufacturing method adopts the core board pre-grooving technology and the technical scheme of manual coating asphalt to protect metal wrapping. The method has defects of reliability and appearance, such as the bottom layer of blind groove and side wall formed superfluous substance by glue, gap cavity at the bottom of blind groove, leakage medium on the side wall of blind groove and low production efficiency. This paper presents a new manufacturing method to solve the above problems. This new method adopts the technology of embedded tape for inner core board before pressing and the technology of mechanical controlled deep grooving for two times after pressing, so as to realize the manufacturing of metal wrapping of stepped blind groove. This new manufacturing method solves the above defects and improves the reliability, appearance and production efficiency.

Keywords： multilayer microwave board stepped blind groove metal wrapping embedded tape technology mechanical controlled deep grooving technology