镀钯铜合金线在汽车电子封装的考量
首发时间:2019-10-22
摘要:本文主要介绍了论文的研究背景,针对汽车电子封装键合目前的现状和未来的发展以及市场生产规范进行了分析,简单阐述了发展汽车电子封装键合所面临的挑战,从而引入具有高可靠性表现的镀钯铜合金线新型材料。通过研究焊线第一二焊点主要的工艺制程参数,得出最优化的工作区间,与传统镀钯铜线进行输出特性表现和可靠性信赖度方面的比较。讨论是否可以改善汽车电子封装键合产品的生命周期,以应对未来车载电子的发展趋势。将此种新型材料导入到封装键合工艺,并能够广泛应用,为同行进行芯片品质改良提供一定的指导作用。
关键词: 半导体材料 镀钯铜合金线 铜线键合 高可靠性 汽车应用
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Au Flash PCC Wire\'s Research in Automotive Application
Abstract:In this paper main focus on the background of automotive semiconductor developing and the criteria of automotive industry, simply explain the challenge for future automotive wire bonding development. In order to meet the automotive high stress requirement, to phase in the Au Flash PCC wire to improve the product aging. Throug the study for 1st and 2nd bond parameter to find the optimum working window, and compare the bonding output data and reliability performance with traditional PCC wire. Discuss this kind of new material if can improve the aging of copper wire product and used in automotive industry. It can provide an effective guideline in automotive copper wire bonding application.
Keywords: Semiconductor material Au Flash PCC wire Copper wire bonding Reliant Reliability Automotive application
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