Kinetically controlled transfer printing based on rate-dependent adhesion is widely used to heterogeneously integrate micro/nano-devices. Through analysis of peeling stamps with grating-like micropatterns from the rigid substrate in different directions, the directionally dependent adhesion strength is investigated in detail. Experiments of peel test and picking up silicon ribbons from silicon-on-insulator wafer were conducted and consistent with the analytical prediction. The method and analytical results proposed in this Letter can guide the design of the micropatterns on stamp to realize a more effective transfer printing approach. We gratefully acknowledge the support from National Natural Science Foundation of China (Grant Nos. 11222220, 90816007, 91116006, 10902059, and 11320101001) and Tsinghua University Initiative Scientific Research Program (Grant No. 2011Z02173).