tThis article introduces a novel type of MEMS probe card that uses polymer (polydimethylsiloxane, PDMS)as an elastic layer. The elastic layer provides the flexibility when the probes are in contact with the chippads. Through-holes in the PDMS and the low temperature co-fired ceramic (LTCC) substrate lead thesignals or power to the back side of the LTCC substrate. The proposed MEMS probe card configurationpotentially improves the probe density and simplifies the fabrication process. The probes are formedby electroplating on the PDMS substrate. The PDMS elastic substrate probe card with a probe pitch of100 m was developed for area array pad testing. The contact force is approximately 18 mN when theprobes overdrive is 20 m. Coplanar waveguides structures can be fabricated on the PDMS surface. Themeasured insertion loss is 0.2 dB at 3 GHz.The test data exhibited that the PDMS elastic substrate probecard is suitable for high-frequency wafer level IC testing.