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期刊论文

Bondability window and power input for wire bonding

韩雷Lei Han* Fuliang Wang Wenhu Xu Jue Zhong

Microelectronics Reliability 46(2006)610-615,-0001,():

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摘要/描述

This paper presents a recent study by monitoring input power in wire bonding process on its performance. The instantaneous driving voltage and current to the PZT/transducer system were recorded and the input power histories for all tests were analyzed. A stable and satisfied bonding can be obtained at moderate ultrasonic power setting. A laser Doppler vibrometer was used to record the response of the structure. The initial power oscillating may represent the phase locking chaos, and the final attenuation may reflect the remains of kinetic energy in the structure. Strength of wire bonding should be attributed to the input power during the main loading segment.

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版权说明:以下全部内容由韩雷上传于   2006年09月15日 01时04分07秒,版权归本人所有。

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