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韩雷

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期刊论文

Wire Bonding Dynamics Monitoring by Wavelet Analysis

韩雷

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摘要/描述

Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics.

【免责声明】以下全部内容由[韩雷]上传于[2007年07月04日 17时00分34秒],版权归原创者所有。本文仅代表作者本人观点,与本网站无关。本网站对文中陈述、观点判断保持中立,不对所包含内容的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考,并请自行承担全部责任。

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