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韩雷

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期刊论文

Experimental observations on nonlinear phenomena in transducer assembly for thermosonic Flip-Chip bonding

韩雷

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摘要/描述

Dynamical characteristics of PZT actuated transducer assembly are the key to reliable flip-chip bonding and basic understanding of metal interconnection. A systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer body and tool, velocity dropping and anomalous phase portrait of the die movement, may be explained by nonlinear features and non-parallel loading of transducer assembly onto its bonding area. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them.

版权说明:以下全部内容由韩雷上传于   2008年06月17日 17时09分02秒,版权归本人所有。

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