-
55浏览
-
0点赞
-
0收藏
-
0分享
-
191下载
-
0评论
-
引用
期刊论文
Packaging technology in MEMS
,-0001,():
MEMS is a relatively new field which is tied so closely with silicon processing that most of the early packaging technologies will most likely use "off-the-shelf" packaging "borrowed" from the semiconductor microelectronics field. In this paper, the present packaging types are first introduced, and then elaborated the Chip Scale Package which is the cost-effective replacement fore the traditional hermetic package, finally, some commercial packages for MEMS devices is given.
【免责声明】以下全部内容由[刘俊]上传于[2005年06月28日 23时33分42秒],版权归原创者所有。本文仅代表作者本人观点,与本网站无关。本网站对文中陈述、观点判断保持中立,不对所包含内容的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考,并请自行承担全部责任。
本学者其他成果
同领域成果