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引用
期刊论文
An apparatus for measuring mechanical properties of microstructures in tensile mode
Scoemce om China Ser. G Physics, Mechanics & Astronomy 2004 Vol. 47 Supp. 127-132，-0001，（）：
An apparatus for measuring mechanical properties of microstructures in tensile mode is described. The apparatus consists of 4 functional parts: piezoelectric actuator, capacitive displacement sensor, specimen gripping mechanism and optical microscope. The configurations and specifications of these parts are elucidated in detail. Specimens used for the tensile mechanical testing are fabricated with the photolithography process. By using this apparatus, the fatigue property of polysilicom films has been measured successfully.
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