Elasticmemorycomposites (EMCs) are receivingmore attention in deployable spacecraft industry because they can realizemuch higher packaging strains without damage and automatically recover to their original shapes when subjected to a specific thermomechanical cycle. Experimental researches have revealed that microbuckling and post-microbuckling responses of compressed fibers in the soft matrix are the primary deformationmechanism ofEMCsto realize higher packaging strains than traditionalcomposites.However, a thorough understanding about the deformation mechanism of EMCs has not yet been achieved. This paper presents a new shear/tension microbuckling solution to study the deformation and failure process of EMC laminates under bending. The microbucklingwavelength, critical compressive stress and strain for carbon-fiber/resin EMC laminates are calculated, and different theoretical solutions are compared with the experimental observation. Moreover, the possible failure modes of this type of materials arediscussed as well.