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期刊论文

Low-dielectric-constant α-SiCOF filmfor ULSI interconnection prepared by PECVD with TEOS/C4F8/O2

张卫P.-F. Wang S.-J. Ding J.-Y. Zhang D. W. Zhang * J.-T. Wang W. W. Lee

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摘要/描述

Amorphous SiCOF films with high carbon concentration are prepared by PECVD (plasma-enhanced CVD) with TEOS/C4F8/O2. The dielectric constant of (α-SiCOF film is reduced to 2.6 and other electric properties are improved remarkably. The moisture resistibility of the film is also improved. Through FTIR and XPS analyses, the chemical construction of α-SiCOF film is investigated. The mechanism of improvements in electrical properties and stability in moisture is further discussed. It is found that the ionic polarization and orientational polarization decrease in α-SiCOF films and contribute a lot to the reduction in dielectric constant. In addition, because of the hydrophobicity of incorporated C−F bonds, the moisture resistibility of α-SiCOF film is improved.

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【免责声明】以下全部内容由[张卫]上传于[2005年10月31日 18时37分12秒],版权归原创者所有。本文仅代表作者本人观点,与本网站无关。本网站对文中陈述、观点判断保持中立,不对所包含内容的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考,并请自行承担全部责任。

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