陈旭
过程装备可靠性,微电子封装技术及可靠性,新型材料力学性能
个性化签名
- 姓名:陈旭
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学术头衔:
博士生导师, 享受国务院特殊津贴专家
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学科领域:
化工机械与设备
- 研究兴趣:过程装备可靠性,微电子封装技术及可靠性,新型材料力学性能
1962年生,工学博士。1997年晋升为教授;1999年被评为博士生导师。曾赴美国、日本、澳大利亚和韩国学术合作研究。教育部机械工程学科过程装备与控制工程专业教学指导委员会委员,中国机械工程学会高级会员,中国机械工程学会压力容器分会理事,中国机械工程学会材料分会理事,中国材料研究学会疲劳分会理事,全国锅炉压力容器标准化技术委员会固定式压力容器委员会委员,《Journal of Pressure Equipment and Systems》,《压力容器》、《化工机械》等期刊编委。担任10多种国际期刊的审稿人.先后主持国家自然科学基金面上项目5项,获国家杰出青年基金海外青年学者合作基金资助。以第一成果人获得2003年教育部高等学校自然科学奖二等奖1项,2002年天津市自然科学三等奖1项。2002年获教育部“高校青年教师奖”,享受国务院特贴专家。发表学术论文120余篇,其中被SCI收录60余篇。被EI收录90余篇。被SCI他人引用300余次.研究课题涉及过程装备可靠性,微电子封装技术及可靠性,新型材料力学性能。对材料在多轴非比例载荷下的低周疲劳进行了大量的试验研究,担任第8届国际多轴疲劳大会(Sheffield,UK)学术委员会委员。已培养毕业博士生16人,硕士生40多人。
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陈旭, 焦荣, 田涛
力学进展,2003,33(4):461~470,-0001,():
-1年11月30日
棘轮应变累积广泛存在于压力容器和管道轮轨接触疲劳、紧固连接和密封技术等工程问题中,是工程设计中必须考虑的重要因素。棘轮可以表现为单轴棘轮效应或多轴棘轮效应,材料的棘轮效应或结构的棘轮效应,本文介绍近年来棘轮效应的最新研究进展,对近年提出的描述材料棘轮效应的循环本构理论作了较详细的评述,对模型的预测能力和存在的问题进行了讨论,并对今后的工作提出了建议。
棘轮效应,, 棘轮应变,, 塑性理论,, 循环本构模型,, 随动强化律
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陈旭, Xu Chen a, *, Rong Jiao a, Kwang Soo Kim b
International Journal of Plasticity 21(2005)161-184,-0001,():
-1年11月30日
This paper evaluates the performance of four Ohno-Wang type constitutive models in predicting ratcheting responses of medium carbon steel S45C for a set of axial/torsional loading paths. Suggestions are also made for further modification. The four models are the Ohno-Wang model, the McDowell model, the Jiang-Sehitoglu model and the AbdelKarim-Ohno model. It is shown that the Ohno-Wang model and the McDowell model overestimate the multiaxial ratcheting. Whereas, the Jiang-Sehitoglu model yields good predictions for most loading conditions used in this study with an appropriate modification of the dynamic recovery term. The AbdelKarim-Ohno model gives acceptable predictions for all considered multiaxial conditions when used with an evolution function for li, but gives poor predictions of uniaxial ratcheting if the parameter li is determined from a multiaxial ratcheting response. A new modified Ohno-Wang hardening rule is proposed for better adaptability under diverse situations by multiplying a factor to the dynamic recovery term, which is dependent on noncoaxiality of the plastic strain rate and back stress. This new model predicts ratcheting strain reasonably well for the test cases.
Ratcheting, Cyclic plasticity, Multiaxial loading, Kinematic hardening, Nonproportional loading, Constitutive model, Multiaxial ratcheting, Kinematic hardening rule
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【期刊论文】Modified kinematic hardening rule for multiaxial ratcheting prediction
陈旭, X. Chen*, R. Jiao
International Journal of Plasticity 20(2004)871-898,-0001,():
-1年11月30日
A modified kinematic hardening rule is proposed in which one biaxial loading dependent parameter δ'0 connecting the radial evanescence term [(α:n)ndp] in the Burlet-Cailletaud model with the dynamic recovery term of Ohno-Wang kinematic hardening rule is introduced into the framework of the Ohno-Wang model. Compared with multiaxial ratcheting experimental data obtained on 1Cr18Ni9Ti stainless steel in the paper and CS1026 steel conducted by Hassan et al. [Int. J. Plasticity 8 (1992) 117], simulation results by modified model are quite well in all loading paths. The simulations of initial nonlinear part in ratcheting curves can be improved greatly while the evolutional parameter δ'0 related to plastic strain accumulation is added into the modified model.
Kinematic hardening rule, Ratcheting, Cyclic plasticity, Multiaxial loading, Constitutive model
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【期刊论文】Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling
陈旭, Y.C. Lin a, X. Chen a, *, Xingsheng Liu b, , Guo-Quan Lu b
Microelectronics Reliability 45(2005)143-154,-0001,():
-1年11月30日
Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The mechanism of substrate flexibility on improving solder joint thermal fatigue was investigated by thermal mechanical analysis (TMA) technique and finite element modeling. The reliability of solder joints in real flip chip assembly with both rigid and compliant substrates was evaluated by accelerated temperature cycling test. Finite element simulations were conducted to study the reliability of solder joints in flip chip on flex assembly (FCOF) and flip chip on rigid board assembly (FCOB) applying Anand model. Based on the finite element analysis results, the fatigue lives of solder joints were obtained by Darveaux s crack initiation and growth model. The thermal strain/stress in solder joints of flip chip assemblies with different substrates were compared. The results of finite element analysis showed a good agreement with the experimental results. It was found that the thermal fatigue lifetime of FCOF solder joints was much longer than that of FCOB solder joints. The thermal strain/stress in solder joints could be reduced by flex buckling or bending and flex substrates could dissipate energy that otherwise would be absorbed by solder joints. It was concluded that substrate flexibility has a great effect on solder joint reliability and the reliability improvement was attributed to flex buckling or bending during temperature cycling.
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陈旭, X. CHEN, S. XU and D. HUANG
Fatigue Fract Engng Mater Struct 22, 679-686,-0001,():
-1年11月30日
A series of multiaxial low-cycle fatigue experiments was performed on 45 steel under non-proportional loading. The present evaluations of multiaxial low-cycle fatigue life were systematically analysed. A combined energy density and critical plane concept is proposed that considers different failure mechanisms for a shear-type failure and a tensile-type failure, and from which different damage parameters for the critical planestrain energy density are proposed. For tensile-type failures in material 45 steel and shear-type failures in material 42CrMo steel, the new damage parameters permit a good prediction for multiaxial low-cycle fatigue failure under non-proportional loading. The currently used critical plane models are a special and simple form of the new model.
multiaxial fatigue, non-proportional loading, damage parameter, fatigue life prediction
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