张建华
(1)半导体照明与显示技术(LED);(2)纳米电子材料与器件;(3)基于TFT的柔性显示器;(4)半导体工艺与机电装备;(5)先进封装材料、工艺与可靠性; (6) 电子垃圾回收与信息电子信息产品无铅管理技术。
个性化签名
- 姓名:张建华
- 目前身份:
- 担任导师情况:
- 学位:
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学术头衔:
博士生导师, 教育部“新世纪优秀人才支持计划”入选者
- 职称:-
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学科领域:
制糖技术
- 研究兴趣:(1)半导体照明与显示技术(LED);(2)纳米电子材料与器件;(3)基于TFT的柔性显示器;(4)半导体工艺与机电装备;(5)先进封装材料、工艺与可靠性; (6) 电子垃圾回收与信息电子信息产品无铅管理技术。
张建华,博士,研究员(教授),博士生导师,新型显示技术及应用集成教育部重点实验室执行副主任。
教育和工作经历:2005年3月迄今 上海大学研究员(教授);2003年10月 – 至今 新型显示技术及应用集成教育部重点实验室、上海大学机电工程与自动化学院副研究员(副教授);2002年10月 - 2003年10月 英国Heriot-Watt大学电子工程与计算机系&爱丁堡微电子微系统研究中心,博士后;2001年6月 - 2002年6月 香港城市大学电子工程学系,高级访问研究(副研究员);1999年8月 - 2001年6月 上海大学机电工程与自动化学院讲师;1996年9月 - 1999年8月 上海大学机电工程与自动化学院攻读博士学位;1996年9月 - 1999年8月 机械科学研究院武汉材料保护研究所攻读硕士学位。
学术兼职:上海市光电子行业协会技术专家;上海半导体照明工程技术中心技术专家;中国机械工程学会摩擦学分会青年理事;中国微纳学会高级会员。
主要荣誉与获奖:(1)2007年度上海市科教系统“三八”红旗手;(2)2006年度第三届宝山区十佳青年;(3)2005年度上海大学优秀青年教师,十佳青年提名奖;(4)2003年度上海市研究生优秀学位论文奖(博士论文)。 研究方向:(1)半导体照明与显示技术(LED);(2)纳米电子材料与器件;(3)基于TFT的柔性显示器;(4)半导体工艺与机电装备;(5)先进封装材料、工艺与可靠性; (6) 电子垃圾回收与信息电子信息产品无铅管理技术。
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成果数
8
【期刊论文】Contact resistance and dhesion performance of ACF interconnections to aluminum metallization
张建华, J.H. Zhang a, Y.C. Chan b, *, M.O. Alam b, S. Fu a
Microelectronics Reliability 43 (2003) 1303-1310,-0001,():
-1年11月30日
Flip chip joining technology using anisotropically conductive films (ACFs) has become an attractive technique for electronic packaging. However, several factors have hindered the wide spread use of this technology. Along with the reliability issue, these factors also include the low availability and high cost of the bumped wafers. This paper introduces the feasibilities of using unbumped die with respect to ACF joints for flip-chip-on-flex (FCOF) assemblies. The unbumped dies contain only bare aluminum pads. Untill now the performance of ACF to Al metallization is a controversial issue from the published reports. In this study, two different test vehicles were used to study contact resistance and adhesion performance. Reliability of contact resistance for ACF joints with the unbumped dies was investigated in terms of varying the thickness of the Al pads. Adhesion performance of ACF to the Al metallization was compared with the adhesion performance of ACF to a glass substrate using the same ACF and the same bonding parameters. FCOF assemblies containing dies with thinner aluminum pads showed lower initial contact resistance and a lower rate of increment during accelerated aging tests. Three factors were considered as the potential causes for the above results: (1) lower concentration of aluminum oxide on the thin Al pad, (2) larger contact area per deformed particle with Au/Ni/Cu electrode for the interconnection of thin Al pad and (3) lower concentration of the defects in the thin Al pad. Contact resistance was found to increase during accelerated testing because of aluminum oxide formation on top of the pads. Contrary to the usual expectation, adhesion strength of ACF with the Al metallization was increased during 60C/95% RH testing. After 500 h of such moisture-soak testing, the adhesion strength becomes 3 times the initial value. The change in chemical state on the aluminum surface is considered to be responsible for higher adhesion strength. It is proposed that oxidation of Al surface due to diffused moisture and the new chemical bond formation at the adhesives/aluminum interface are the key reasons for good adhesion reliability.
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【期刊论文】Design and Mechanics Simulation of Bionic Lubrication System of Artificial Joints
张建华, S.H. Su, Z.K. Hua, J.H. Zhang
Journal of Bionic Engineering 3 (2006) 155-160,-0001,():
-1年11月30日
We prostheses that omit many functions of the lubricant and the joint capsule. The new structure is composed of three components: lubricant, artificial joint and artificial joint capsule. The lubricant sealed in the capsule can not only reduce the wear of the artificial joint but also prevents the wear particles leaking into the body. So unexpected reactions between the wear particles and body can be avoided completely. A three-dimensional (3-D) finite element analysis (FEA) model was created for a bionic knee joint with capsule. The stresses and their distribution in the artificial capsule were simulated with different thickness, loadings, and flexion angles. The results show that the maximum stress occurs in the area between the artificial joint and the capsule. The effects of capsule thickness and the angles of flexion on stress are discussed in detail.
artificial joint, bionic joint capsule, 3-D FE
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【期刊论文】A Low Cost Bumping Method for Flip Chip Assembly and MEMS Integration
张建华, Jianhua Zhang, Changhai Wang, Jun Zeng, and Ah Ju Pang
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL.30, NO.4, DECEMBER 2007,-0001,():
-1年11月30日
In this paper, we present the development of a low cost chip/wafer bumping technique for flip chip assembly and microelectromechanical systems integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel, and gold bumps are fabricated on a lowcost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallized with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Thermal cycling and bump shear test showed that reliable bonding was obtained between the bumps and the pads. Surface study using laser ionization mass analysis found no traces of of the polymer carrier on the surface of the bumps on the test chip after the completion of the bump transfer process.
Bumping, flexible carrier, flip chip, microelectromechanical systems (, MEMS),
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【期刊论文】Several difficult problems in lubrication
张建华, TAO Dehua & ZHANG Jianhua
SCIENCE IN CHINA (Series A) Vol.44 Supp. August 2001,-0001,():
-1年11月30日
Whether in industry or in our human life, we will encounter many lubrication problems. A good lubricant not only should have good performance, but also should meet the needs of the specific conditions. Here we give some examples about the difficult problems in lubrication and their solutions. These examples are: (i) hydrolysis and emulsion of ZDTP; (ii) corrosion of chlorowax; (iii) coexistence of green compressor oil and cryogen (R-134A); (iv) lubrication of cystoscope and catheter. On the same time, some achievements in lubrication field provided by Lubrication Chemistry Laboratory of Shanghai University will be introduced in this paper.
lubrication, ZDTP, chlorowax, green compressor oil, lubrication of cystoscope and catheter
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【期刊论文】新型 人工关节仿生润滑系统设计及滑液磨擦学特性研究
张建华, 陶德华, 付尚发, 李健, 赵源
摩擦学学报,2003,23(6):500~503,-0001,():
-1年11月30日
通过摩擦学系统分析,指出了目前人工关节无润滑系统的结构缺陷,为解决此缺陷提出一种包括生物浓液、人工关节摩擦配副和仿生关节囊的新型人工仿生关节学系统结构,并对系统设计以及其改善现有人工关节系统润滑的潜在优越进行了讨论,采用销-盘摩擦试验机对影响人工关节仿生润滑系统摩擦学性能的滑液进行了模拟试验前的快事速初步评价,结果表明,滑液可显著改善人工关节副的摩擦学特性,但其效果同系统条件其结构无素有关,在研记生滑液和设计其摩擦学特性模拟试验方法时,必须结合这些影响因素进行设计和试验。
人工关节, 仿生润滑, 系统设计, 摩擦学特性
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张建华, 苏世虎, 陶德华
摩擦学学报,2006,26(1):32~35,-0001,():
-1年11月30日
基于仿生人工关节结构,利用连杆机构模似关节弯曲/拉伸运动方式建立了仿生人工关节评价装置,同时对以小牛血清作为润滑介质的氧化锆-超高子量聚乙烯(ZrO-UHMWPE)人工关节配副进行磨损性能测试,结果表明:所建立的装置不仅可以加速考察人工关节配副的磨损特性,还能够加速评价仿生关节囊的动态疲劳性能,同时实现转速、载荷以及运动角度等参数可调并具有较强可操作性;UHMWPE 的磨损量与运动周期近似呈线性关系,UHMWPE 的体积磨损率相对稳定,约为70~80mm3/10周期,且具有较好的重复性与可靠性。
超高分子量聚乙烯(, UHMWPE), , 仿生人工关节, 仿生关节囊, 磨损评价
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【期刊论文】以Coutte流动方式为基础的电流变液测试系统的研制*
张建华, 冯常勤, 陶德华, 张直明
仪器仪表学报,2004,25(3):306~309,-0001,():
-1年11月30日
在分析电流变液(Eleoctrorheological fluids)测试技术特点的基础上,研制了一种基于库特(Couette)流动方式的电流变测试系统。对由上海大学研制的几种电流变液进行了性能测试,结果表明所建立的电流测试仪具有较好的重复性与可行性,可以准确、方便地获得与电流变效应有关的剪切应力、学习漏电流等方面的信息。
电流变测试议, 电流变液, Couette流动
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张建华, Zhang Jian-hua, Zhang Zhi-ming, Tao De-hua
Journal of Shanghai University (English Edition) ISSN 1007-6417, Vol,4, No.3(Sep.2000), pp 243-245,-0001,():
-1年11月30日
electrorheological(, ER), material, chitosan, hollow cenosphere, compsite particles, performance properties
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