李敬锋
压电陶瓷及其薄膜,热电材料及其微器件, MEMS材料微细制备技术;功能梯度材料;陶瓷材料制备与力学性能评价等
个性化签名
- 姓名:李敬锋
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学术头衔:
博士生导师, “973”、“863”首席科学家, 国家杰出青年科学基金获得者
- 职称:-
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学科领域:
材料科学
- 研究兴趣:压电陶瓷及其薄膜,热电材料及其微器件, MEMS材料微细制备技术;功能梯度材料;陶瓷材料制备与力学性能评价等
李敬锋,教授,博士生导师,清华大学材料科学与工程系副系主任。国家杰出青年基金获得者。中国硅酸盐学会理事,中国微米纳米技术学会理事,Journal of Materials Processing Technology (Elsevier, SCI) 副主编,中国《硅酸盐学报》编委责任编辑,教育部回国人员科研启动基金评审专家,美国陶瓷学会会员,日本陶瓷协会会员,中国机械工程学会高级会员。1980年毕业于华中科技大学,教委公派留学日本,分别于1988年和1991年获日本东北大学工学硕士和工学博士,1992年-2002年任日本东北大学助理教授,副教授(1997-2002),期间曾于1998年3至5月在美国华盛顿大学做访问学者,2002年初回国工作。1995年获日本金属学会青年研究者奖,1998年获日本原田研究奖,2003年获国家杰出青年基金。
目前主要研究方向包括:压电陶瓷及其薄膜,热电材料及其微器件, MEMS材料微细制备技术;功能梯度材料;陶瓷材料制备与力学性能评价等。承担973,863,国家自然科学基金等科研项目多项。目前在清华大学材料系主讲“MEMS材料及微细制备技术”,“信息能源新材料导论”,“陶瓷断裂力学”等课程。
至今为止已发表论文170余篇,SCI收录90余篇,SCI论文被引用450余次(他引350余次),申请国内外专利11项。主编“新材料概论(冶金工业出版社)”,“新能源材料及其应用技术”(清华大学出版社)”,编著“High-Performance Ceramics III”(ttp Trans Publications出版社)。
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4
李敬锋, Wen Gong, Jing-Feng Li*, Xiangcheng Chu, Zhilun Gui, Longtu Li
W. Gong et al./Acta Materialia 52(2004)2787-2793,-0001,():
-1年11月30日
Lead zirconate titanate (PZT) thin films with a composition near the morphotropic phase boundary region were deposited onto Pt(111)/Ti/SiO2/Si(100) substrates using a sol-gel method. A seeding layer was introduced between the most underlying surface of the PZT film and the platinum electrode surface to control the texture of the PZT thin film. The lead oxide seeding layer resulted in the formation of a single-phase perovskite and absolutely (100)-textured PZT film. SEM, XRD, XPS, and AES were used to characterize the evolution of the lead oxide layer and the PZT thin films. The growth kinetic mechanism of the (100)-textured PZT thin films was proposed phenomenologically. The ferroelectric and piezoelectric properties of the PZT films were also evaluated and discussed in association with different preferential orientations.
Thin films, Texture, Piezoelectricity, Ferroelectricity, Sol-gel
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【期刊论文】Microfabrication of thermoelectric materials by silicon molding process
李敬锋, Jing-Feng Li a, b, ∗, Shuji Tanaka c, Toshiya Umekib, Shinya Sugimoto c, Masayoshi Esashi d, Ryuzo Watanabe b
J.-F. Li et al./Sensors and Actuators A 108(2003)97-102,-0001,():
-1年11月30日
Thermoelectric microgenerators and microcoolers are becoming technologically important for microelectromechanical systems (MEMS), but the conventional cutting and assembling techniques have limitation in miniaturizing the dimensions of thermoelectric devices to the micrometer order. We have combined MEMS technology and materials processing into a novel process to manufacture thermoelectric micro-modules with densely aligned fine-scale and high-aspect-ratio P-N elements. Our process consists of the following major steps: (1) micromachining a silicon mold; (2) filling the mold with thermoelectric materials; (3) connecting P-and N-type elements and assembling the whole module. By using the present process, Bi-Sb-Te system thermoelectric elements of 300m height and 40m cross-sectional width can be fabricated successfully.
Microfabrication, Thermoelectric device, Silicon molding, Materials micro-processing
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【期刊论文】MECHANICAL PROPERTIES OF POLYCRYSTALLINE Ti3SiC2 AT AMBIENT AND ELEVATED TEMPERATURES
李敬锋, J.-F. LI†, W.PAN, F.SATO and R. WATANABE
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-1年11月30日
Dense polycrystalline Ti3SiC2 samples were fabricated by reactively hot-isostatic pressing (HIPing) a mixture of elemental Ti, Si and C powders. The mechanical properties, including load-strain response, bending strength, fracture toughness and crack propagation, were investigated from ambient temperature to 1573 K. Non-linear stress-strain responses were observed in the polycrystalline Ti3SiC2 materials at ambient temperature. It is conceivable that the inelastic deformation is attributable to micro-deformations that consist of slip between micro-lamellae within individual grains and the formation of microcracks between grains. The polycrystalline Ti3SiC2 exhibited a brittle-to-ductile transition at about 1473K; above this the Ti3SiC2 samples deformed plastically and exhibited high strains (>1.5%), whereas below 1373K only limited inelastic deformation was observed prior to fracture. The mode I fracture toughness, KIC, was measured by the single-edge notched beam (SENB) method to be 4.52MPa m1/2 at ambient temperature. Both fracture strength and fracture toughness decrease only slightly with increasing temperature up to 1273K, above which they decrease more rapidly and reach half of their room-temperature values by 1473K.
Mechanical properties—high temperature, Brittle-to-ductile transition, Fracture &, fracture toughness, Hot isostatic pressing (, HIP),
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李敬锋, Jing-Feng Li, *†‡, Kenta Takagi, ‡, Masaru Ono, Wei Pan, †, and Ryuzo Watanabe‡, Abdulhakim Almajid and Minoru Taya
J. Am. Ceram. Soc., 86[7]1094-98(2003),-0001,():
-1年11月30日
Porous ceramics of lead zirconate titanate (PZT) were prepared by sintering powder compacts consisting of PZT and stearic acid powders in an air atmosphere; stearic acid was added as a pore-forming agent (PFA). The dielectric, elastic and piezoelectric properties of uniformly porous PZT ceramics were investigated as a function of the porosity volume fraction. Furthermore, a beam-shaped PZT actuator sample with a graded porosity content across its thickness was fabricated by sintering PFA-graded powder compacts. The electric-fieldinduced bending displacement characteristics of the actuator samples were measured by using strain gauges and were found to be in good agreement with the theoretical predication based on a classical lamination theory.
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