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【期刊论文】Global Clock, Physical Time Order and Pending Period Analysis in Multiprocessor Systems
arXiv,2009,():
2009年07月12日
In multiprocessor systems, various problems are treated with Lamport's logical clock and the resultant logical time orders between operations. However, one often needs to face the high complexities caused by the lack of logical time order information in practice. In this paper, we utilize the \emph{global clock} to infuse the so-called \emph{pending period} to each operation in a multiprocessor system, where the pending period is a time interval that contains the performed time of the operation. Further, we define the \emph{physical time order} for any two operations with disjoint pending periods. The physical time order is obeyed by any real execution in multiprocessor systems due to that it is part of the truly happened operation orders restricted by global clock, and it is then proven to be independent and consistent with traditional logical time orders. The above novel yet fundamental concepts enables new effective approaches for analyzing multiprocessor systems, which are named \emph{pending period analysis} as a whole. As a consequence of pending period analysis, many important problems of multiprocessor systems can be tackled effectively. As a significant application example, complete memory consistency verification, which was known as an NP-hard problem, can be solved with the complexity of O(n2) (where n is the number of operations). Moreover, the two event ordering problems, which were proven to be Co-NP-Hard and NP-hard respectively, can both be solved with the time complexity of O(n) if restricted by pending period information.
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【期刊论文】Godson-3: A Scalable Multicore RISC Processor with x86 Emulation
IEEE Micro,2009,29(2):17 - 29
2009年04月07日
The Godson-3 microprocessor aims at high-throughput server applications, high-performance scientific computing, and high-end embedded applications. It offers a scalable network on chip, hardware support for x86 emulation, and a reconfigurable architecture. The four-core Godson-3 chip is fabricated with 65-nm CMOS technology. Eight- and 16-core Godson-3 chips are in development.
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