A new method for silver electroless deposition on Si(100) wafer, based on the silver itself as the seed layer, was developed. The seed layer was first deposited onto the etched wafer surface in an acidic solution of 0.005 mol 1-1 AgNO3+0.06 mol 1-1 HF. Then the silver thin film was electrolessly deposited upon the seed layer in the electroless bath of AgNO3+NH3+acetic acid+NH2NH2 (pH 10.2). The NH2NH2 was taken as the reducing agent. The morphology of the seed layer and the silver film were characterized by atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and energy-dispersive X-ray analysis (EDX). The experimental results indicated that the seed layer showed excellent catalytic function for silver electroless deposition.

The anodic stripping behavior of the Ag seed layers on a p-silicon (100) wafer was studied by cyclic voltammetry (CV). The seed layers were prepared by immersing the silicon wafer in a solution of 0.005 M AgNO3+0.06 M HF at room temperature. Then the layer adhered wafers were used as the work electrodes. The oxidation energy of the Ag monolayer based on the Si-Ag combination was observed and the oxidation energy of the Ag multilayer based on the Ag-Ag combination was also found.

The underpotential deposition (UPD) of antimony(Ⅲ) on gold electrode was studied by using cyclic voltammetry (CV). Based on the excellent electrochemical properties of the Au/Sb UPD system, a new method for determination of antimony was developed. In this case, a more sensitive lectroanalytical technique, 1.5th order differentialanodic stripping voltammetry (1.5th ODASV), was used. A solution of 0.1 mol/L HCl was selected as the supporting electrolyte. Factors affecting the Sb(Ⅲ) UPD and stripping steps were investigated and an optimized analytical procedure was proposed. The calibration plots for Sb(Ⅲ) concentration in the range 1.25×10-8-3.38×10-7 mol/L were obtained. A detection limit of 2.1×10-9 mol/L was found for a 120 second electrochemical deposition at 0.100 V while the solution was stirred magnetically at a speed of 300 rpm. For 9 successive determinations of 2.5×10-8 mol/L Sb(Ⅲ), relative standard deviations, RSD, of 0.55% was obtained. The developed method was applied to antimony determination in ore samples.

在氯化亚锡敏化、氯化钯活化的条件下，通过化学镀方法，成功地在纳米金刚石粉体表面制备了超薄铜膜。用X 射线粉末衍射（XRD）和傅立叶红外吸收光谱（FTIR）表征了该Cu-金刚石纳米复合材料。此种复合材料在无水乙醇中超声分散5min后的溶胶可稳定存放半年之久而不见沉降。

This work describes a study of the underpotential deposition (UPD) of Sn2+ on a polycrystalline gold disc electrode using cyclic voltammetry (CV) and chronocoulometry (CC). Sn2+ ions showed well-defined peaks from UPD and UPD stripping (UPD-S) in 1 mol/L HCl solutions, while bulk deposition (BD) and BD stripping (BD-S) of the ions were also observed. The measured UPD shifts, DEUPD, between the UPD-S and the BD-S peaks were more than 200 mV. The UPD charge and the surface coverage of tin were measured by CC. A new method for determining Sn2+ was therefore developed, based on the excellent electrochemical properties of the Au/Sn UPD system. A plot of the UPD-DPASV (differential pulse anodic stripping voltammetry) signal versus the Sn(II) concentration was obtained for [Sn(II)] of 1.98