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【期刊论文】Lowresistance Ti/Al/Ti/Au multilayer ohmic contact to nGaN
冯士维, DongFeng Wang, Feng Shiwei, C. Lu, Abhishek Motayed, Muzar Jah, and S. Noor Mohammada), Kenneth A. Jones, L. SalamancaRiba,
JOURNAL OF APPLIED PHYSICS VOLUME 89, NUMBER 11 1 JUNE 2001,-0001,():
-1年11月30日
A metallization scheme has been developed for obtaining low ohmic contacts to nGaN with a low contact resistance. The metal contact is a Ti/Al/Ti/Au composite with layers that are respectively 30, 100, 30, and 30 nm thick. Contacts with a specific contact resistivity r s, as low as 6.0 31027 V cm2 for a doping level of 1.4031020 cm23 were obtained after annealing the sample for 30 s at 750℃ in a rapid thermal annealer. The Ti placed on top of the traditional Ti/Al contact appears to have the advantage of tying up the excess Al; therefore it does not form a mottled contact. Some of the additional Ti-Al intermetallic alloys that are formed also have beneficial effects. The Ti-Au layer forms a robust upper portion of the composite, which enables the contacts to have hightemperature applications.
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