A new physical model----Uneven Liquid Film Model for gas diffusiong porons electrode is presented in this paper. By eapillary force, the rough envelope surface of the eatalyat ogglo-merate is eovered with the e4lectrolytie solution film, which possesses different thicknesses for different parts. In practical current density region, the linear behavior and the effects of partial pressure of gas reactant, the thiekness of catalytie layer, and the composition of elec-trolytie solution on the polarization curve are all in agreement with those predieted by digital and analytieal solutions of the new model.

The adsorption of CD on a p electrode was used as a mofecufar probe, and the surface properties with respect to the electronis structure of the p electrocatalyst during modification by S or Bi adatoms were investigated by a combination of cyclic voltasmmetry, in-situ Fourier transform IR (FTIR) SPECTROSCOPY AND clusters model analysis using self-consistente charge discrete variational Xn (SCC-DV-Xn) calculations. It is found that she S adatome decteases the ability of the Pt surface to donate electrons. Resulting in weakened CO adsorption and increasing vibrational frequency of the OSO band of adsorbed CO molecules. However. The opposite effects were observed in the case of Bi-adatomes. The electronic and vibrational properties of the potenmith dependence of CO adsorbed on a Pt electrode were also studied carefully. The results of quantum chemistry calculations are in good agreement with the experimental results of in-situ FTIR spectroncopy and also reveal the deeper significance of the IR spectroscopy data.

The conventional suppREssor column, packed with a suitable ioN-exchange resin, must be regenerated periodically, The elutien times and detector response for some ions vary drastically according to the extent of exhaustion of the suppressor column. Band spreading and loss of resolutiontake place in the suppressor column These drawbacks have been overcome byintroduction of the ion-exchange fibre sup- presser1(FS)

The ionization equilibrium is calculated for a suppressor efluent containing remnations, e.g., Na+ in the case of anion analysis, due to imperfect suppression. It is shown that: (1) The remnation not only affects the background specific con-ducivity but also seriously depresses the peak height of ideal peak height. For Pkha >11, the practical peak height may be negative. (2) The sensitivity, linearity and reproducibili of conductivity detection for low concentration samples are seriously affected by the remnantion, i.e., by the conversion efficiency of the suppressor. (3) The ionization of the waek acid derived from the eluent is depressed by the commonion effect strong acid derived from the sample. The peakheight depression denends on the ionization constant, KHA. However, in the case of CNa>0, the buffer effect of HA compensates the effect of remnant Na+, Therefore it is appropriate to use eluent with PKHA in the range 6-8.

In order to realize two-dimensional lithography at high resoulution (several tens of nanometers), a new approach to the lithography of a fine pattern using a confined etchant layer technique (CELT) in an electrochemical system is presented. A mould plate of conductive material with a high-resoulution line pattern (which can be prepared with the aid of e.g. electron beams) is used instead of the tip in scanning tunneling microscopy (STM). The etchant species is generated at the surface of the muld plate by electrochemical photochemical or photoelectrochemical methods, then diffuses away from the surface of the mould plate. The key feature of CELT is the design of a chemical reaction which rapidly destroys the etchant (e.g. within microseconds on average) following its generation. Therefore, the gradient of the concentration of etchant can be greastly enhanced and the thickness of the diffusiong layer can be greatly decreased to several tens of nanometers. Thus, the etchant layer is confined and its outer boundary can essentially retain the fine structure of the pattern of the mould plate. Then the substrate to be corroded is adjusted by ECSTM to approach the mould plate within several tens of nanometers and the corroded pattern can retain the fine structure giving a resolution of several tens of nanometres.