Research on the Inspiration of Quality Assurance of Automotive Grade Devices for Aerospace Device Application Verification

• 1、Beijing University of Posts and Telecommunications, School of Electrical and Electronic Engineering, Beijing, 100876
• 2、Beijing Institute of Space Science and Technology Information, Beijing, 100086

Abstract：In the turbulent international situation of key component embargoes imposed by countries such as Europe and America on China, the supply of aerospace grade components in China is facing many challenges such as reduced manufacturers, and high manufacturing costs. It is urgent to carry out feasibility assessments of replacing aerospace grade components with low-grade components to provide reference basis for solving this dilemma. This article compares and analyzes the quality assurance testing indicators of automotive grade chips and aerospace grade chips in China and the United States based on different application scenarios, including temperature cycling testing conditions, impact resistance, steady-state life testing, and radiation resistance performance. Targeted screening is proposed for indicators with similar testing conditions, The application verification approach of strengthening system design to compensate for insufficient chip design process for significantly different radiation resistance indicators suggests that using automotive grade integrated circuits to replace aerospace grade devices is feasible.

Keywords： automotive grade components Aerospace grade components quality assurance standards application validation