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李敬锋

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期刊论文

Microfabrication of thermoelectric materials by silicon molding process

李敬锋Jing-Feng Li ab Shuji Tanaka c Toshiya Umekib Shinya Sugimoto c Masayoshi Esashi d Ryuzo Watanabe b

J.-F. Li et al./Sensors and Actuators A 108(2003)97-102,-0001,():

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摘要/描述

Thermoelectric microgenerators and microcoolers are becoming technologically important for microelectromechanical systems (MEMS), but the conventional cutting and assembling techniques have limitation in miniaturizing the dimensions of thermoelectric devices to the micrometer order. We have combined MEMS technology and materials processing into a novel process to manufacture thermoelectric micro-modules with densely aligned fine-scale and high-aspect-ratio P-N elements. Our process consists of the following major steps: (1) micromachining a silicon mold; (2) filling the mold with thermoelectric materials; (3) connecting P-and N-type elements and assembling the whole module. By using the present process, Bi-Sb-Te system thermoelectric elements of 300m height and 40m cross-sectional width can be fabricated successfully.

【免责声明】以下全部内容由[李敬锋]上传于[2006年07月07日 18时51分13秒],版权归原创者所有。本文仅代表作者本人观点,与本网站无关。本网站对文中陈述、观点判断保持中立,不对所包含内容的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考,并请自行承担全部责任。

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