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期刊论文

Evolution of microstructure and dimension of as-molded parts during thermal removal process of wax2based MIM binder ①

李益民LI Yi-min (李益民) HUAN Gbai-yun (黄伯云) LI Songlin (李松林) ZEN G Zhou-shan (曾舟山) QU Xuan-hui (曲选辉)

Trans. Nonferrous Met. Soc. China Jun. 2001 Vol. 11 №.3  ,-0001,():

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摘要/描述

The evolution of the microstructure and the dimension of as-molded parts were studied on the basis of the thermogravimetric analysis of wax-based MIM binder. The results show that the binder removal speeds are different in different temperature ranges during binder removal process. The evolution of the microstructure of as-molded parts during binder removal process clearly showed the initiation and formation of connected pore structure , which is the removal chan-nel of the binder. The as-molded parts almost continuously shrank through binder removal process, except an expansion stage during 320~440℃, which is the dissolution expansion effect due to the dissolution of VPW in the polymer melt.

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