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余寿文

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Micro-scale adhesive contact of a spherical rigid punch on a piezoelectric half-space

余寿文Z.R. Chen S.W. Yu*

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摘要/描述

The micro-scale adhesive contact behavior of a spherical rigid punch on a piezoelectric half-space is investigated in this paper. The governing equations describing the adhesive contact behavior are obtained by using the Maugis-Dugdale (M-D) elastic adhesive contact theory [J. Colloid Interface Sci. 150 (1992) 243]. The solutions for indentation of piezoelectric materials and for elastic adhesive contact can be reduced from the present results in the absence of adhesion effect and piezoelectric effect, respectively. The effect of the electric load on the adhesive contact behavior is analyzed. It is shown that the piezoelectric effect has a significant effect on the adhesive contact behavior of piezoelectric materials. The obtained results will be helpful to understand the micro-indentation properties of piezoelectric materials.

【免责声明】以下全部内容由[余寿文]上传于[2005年06月29日 22时27分54秒],版权归原创者所有。本文仅代表作者本人观点,与本网站无关。本网站对文中陈述、观点判断保持中立,不对所包含内容的准确性、可靠性或完整性提供任何明示或暗示的保证。请读者仅作参考,并请自行承担全部责任。

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