The existence of multi-axial states of stress cannot be avoided in elevated temperature components. It is essential to understand the associated failure mechanisms and to predict the lifetime in practice. Although metal creep has been studied for about 100 years, many problems are still unsolved, in particular for those involving multi-axial stresses. In this work, a state-of-the-art review of creep analysis and engineering design is carried out, with particular emphasis on the effect of multi-axial stresses. The existing theories and creep design approaches are grouped into three categories, i.e., the classical plastic theory (CPT) based approach, the cavity growth mechanism (CGM) based approach and the continuumdamage mechanics (CDM) based approach. Following above arrangements, the constitutive equations and design criteria are addressed. In the end, challenges on the precise description of the multi-axial creep behavior and then improving the strength criteria in engineering design are presented.

Based on the comprehensive finite element (FE) creep analyses, the influence of free surface on the time dependent fracture mechanics parameter of a crack near the free surface in plates under tension has been investigated. It is found that the time dependent fracture parameter C∗ increases as the crack tip closes to the free surface. Such an increment is related not only to the crack configurations but also to the material properties, especially the creep exponent n of power creep law. In addition, more pronounced interaction is observed between the C∗ of subsurface crack and that of a single isolated crack compared to that denoted by SIF under the linear elastic fracture condition. Under the framework of reference stress method, we also developed a closed form solution for creep interaction factor. Overall good agreement is achieved between the proposed method for the C∗ of subsurface crack and the FE results which provides us confidence in practical application.

A general theoretical model was developed to predict the creep deformation and its effect on the stress relaxation and distribution in the multilayer systems under residual stress and external bending. Based on the proposed solution, a simplified solution for the special case of one film layer on a substrate is also presented. Finite element analysis was carried out to validate the presented model. Good agreements were observed between the finite element simulation and the prediction of the proposed model. In addition, the effects of film thickness on creep strain and stress distribution, the creep effect on neural axis location in the bilayer assembly subjected to the combination of residual stress and external bending were also discussed.

Interaction between diffusion and stress fields has been investigated extensively in the past. However, most of the previous investigations were focused on the effect of chemical stress on diffusion due to the unbalanced mass transport. In this work, the coupling effects of external mechanical stress and chemical stress on diffusion are studied. A self-consistent diffusion equation including the chemical stress and external mechanical stress gradient is developed under the framework of the thermodynamic theory and Fick's law. For a thin plate subjected to unidirectional tensile stress fields, the external stress coupled diffusion equation is solved numerically with the help of the finite difference method for one-side and both-side charging processes. Results show that, for such two types of charging processes, the external stress gradient will accelerate the diffusion process and thus increase the value of concentration while reducing the magnitude of chemical stress when the direction of diffusion is identical to that of the stress gradient (M•D=1). In contrast, when the direction of diffusion is opposite to that of the stress gradient (M•D=-1), the external stress gradient will obstruct the process of solute penetration by decreasing the value of concentration and increasing the magnitude of chemical stress. For both-side charging process, compared with that without the coupling effect of external stress, an asymmetric distribution of concentration is produced due to the asymmetric mechanical stress field feedback to diffusion.