In this paper, we present the development of a low cost chip/wafer bumping technique for flip chip assembly and microelectromechanical systems integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel, and gold bumps are fabricated on a lowcost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallized with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Thermal cycling and bump shear test showed that reliable bonding was obtained between the bumps and the pads. Surface study using laser ionization mass analysis found no traces of of the polymer carrier on the surface of the bumps on the test chip after the completion of the bump transfer process.

Whether in industry or in our human life, we will encounter many lubrication problems. A good lubricant not only should have good performance, but also should meet the needs of the specific conditions. Here we give some examples about the difficult problems in lubrication and their solutions. These examples are: (i) hydrolysis and emulsion of ZDTP; (ii) corrosion of chlorowax; (iii) coexistence of green compressor oil and cryogen (R-134A); (iv) lubrication of cystoscope and catheter. On the same time, some achievements in lubrication field provided by Lubrication Chemistry Laboratory of Shanghai University will be introduced in this paper.

基于仿生人工关节结构，利用连杆机构模似关节弯曲/拉伸运动方式建立了仿生人工关节评价装置，同时对以小牛血清作为润滑介质的氧化锆-超高子量聚乙烯（ZrO-UHMWPE）人工关节配副进行磨损性能测试，结果表明：所建立的装置不仅可以加速考察人工关节配副的磨损特性，还能够加速评价仿生关节囊的动态疲劳性能，同时实现转速、载荷以及运动角度等参数可调并具有较强可操作性；UHMWPE 的磨损量与运动周期近似呈线性关系，UHMWPE 的体积磨损率相对稳定，约为70～80mm3/10周期，且具有较好的重复性与可靠性。