Dynamical characteristics of PZT actuated transducer assembly are the key to reliable flip-chip bonding and basic understanding of metal interconnection. A systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer body and tool, velocity dropping and anomalous phase portrait of the die movement, may be explained by nonlinear features and non-parallel loading of transducer assembly onto its bonding area. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them.

The authors demonstrate that the ultrasonic vibration in flip chip FC bonding results in the generation of dislocations, and the atomic diffusion can be activated more easily along the dislocation lines which perform the fast diffusion channels, thus the dislocation diffusion is probably more prominent than the body diffusion during ultrasonic bonding. To minimize the intermetallic compound layer, the effectiveness of a different bonding approach is confirmed. Furthermore, an experiment-based mode of ultrasonic energy conversion was found that the ratio of up interface to down interface in ultrasonic FC bonding was about 2.3:1.

This study seeks to quantify the screw-fastening effect of the tool/transducer on wire bonding performance. Aluminum wire bonding experiments were performed on a laboratory test bench. Characterizations of bonding process through a wavelet analysis were used to study the relation between screw fastening, vibration behaviors and bond strength. The time-frequency plots were depicted for identifying un-modeled wire bonding dynamics. Finally some statistically time domain features were presented for further analysis.

介绍了作为近年来国际上研究热点之一的智能材料和智能结构的概念、原理和研究动态。并对今后的发展、应用前景进行了讨论。

使用红外测温仪对加热台及微型叠层芯片表面进行测试，对所获得的温度数据进行分析建模。发现叠层芯片结构表面悬臂区域和非悬臂区域的温度存在差异，并讨论其原因。进一步对不同区域的温度曲线进行拟合，发现Logistic模型可用于叠层芯片结构测温数据的建模和阐释其温升机制缘由。实验结果有助于叠层芯片悬臂键合动力学机理的研究。