The effect of the temperature on bondability and bonding process for wire bonding are investigated. Bondability is characterized by shear bonding strength and bonding process is represented by input and output power of ultrasonic transducer. A laser Doppler vibrometer and Labview software were used to record the velocity, voltage and current of transducer at different temperature settings. A K-type thermocouple sensor was used to measure the bonding temperature. Experimental results show that unsuccessful bonding happens at low temperature, and over bonding appears if the temperature is too high. Only when the temperature is at appropriate settings, can a stable and satisfied bondability be attained. The reason for this experimental observation is analyzed. By using a high resolution transmission electron microscope, the atom diffusion depth of Au-Ag bonding interface was measured and the result is about 200 nm. By using joint time-frequency analysis, the instantaneous characteristics of bonding process were observed completely and clearly. It is found that input and output ultrasonic power vs. time-frequency in a bonding process, including resonance frequency, harmonic components and amplitude of ultrasonic energy, vary along with the change of temperature settings.

Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics.

This paper presents a recent study by monitoring input power in wire bonding process on its performance. The instantaneous driving voltage and current to the PZT/transducer system were recorded and the input power histories for all tests were analyzed. A stable and satisfied bonding can be obtained at moderate ultrasonic power setting. A laser Doppler vibrometer was used to record the response of the structure. The initial power oscillating may represent the phase locking chaos, and the final attenuation may reflect the remains of kinetic energy in the structure. Strength of wire bonding should be attributed to the input power during the main loading segment.

This study seeks to quantify the screw-fastening effect of the tool/transducer on wire bonding performance. Aluminum wire bonding experiments were performed on a laboratory test bench. Characterizations of bonding process through a wavelet analysis were used to study the relation between screw fastening, vibration behaviors and bond strength. The time-frequency plots were depicted for identifying un-modeled wire bonding dynamics. Finally some statistically time domain features were presented for further analysis.

Dynamical characteristics of PZT actuated transducer assembly are the key to reliable flip-chip bonding and basic understanding of metal interconnection. A systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer body and tool, velocity dropping and anomalous phase portrait of the die movement, may be explained by nonlinear features and non-parallel loading of transducer assembly onto its bonding area. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them.

介绍了作为近年来国际上研究热点之一的智能材料和智能结构的概念、原理和研究动态。并对今后的发展、应用前景进行了讨论。

使用常规、微观电镜、动力相图和统计时频分析等方法, 进行了引线键合机理的实验研究. 通过对换能 系统和劈刀振速的高频分量、键合压力的测试, 以及键合界面微观结构的观察, 建立了键合区域宏观受载等效模型, 和对键合机理的框架认识. 可作为键合过程优化的指导, 和键合动力学建模的依据.

为测试微悬臂芯片的动态特性，建立以压电陶瓷为激振底座的测试系统。采用白噪声、稳态正弦和快速 正弦( 啁啾信号) 扫频方式激励微叠层悬臂芯片，由多普勒测振仪测试芯片动态响应。通过分析压电陶瓷阻抗变化与芯 片动态响应，获得的频率对应于压电陶瓷激振器所激励叠层芯片的一阶共振频率，可作为微结构和器件动态分析的测试 方案。

利用基于关联维数的相位随机化的替代数据算法,对不同键合压力下超声换能系统中换能杆末端轴向振动的实测数据进行正确替代,并用非线性动力学的理论来检验其是否具有非线性。通过实验对所测振动时间序列的关联维数进行计算,结果表明在实际键合过程中,不同键合压力下变幅杆末端轴向振动都具有非线性成分。这有利于更好地认识超声引线键合换能系统,并为进一步利用非线性时间序列分析方法研究引线键合过程中的复杂振动提供了深入分析的科学手段。