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2005年02月22日

【期刊论文】Numerical Simulation of Brazing TiC Cermet to Iron with TiZrNiCu Filler Metal

冯吉才, Lixia ZHANG, Jicai FENG*

,-0001,():

-1年11月30日

摘要

The maximum value of thermal stress and stress concentration zones of iron/TiC cermet joint during cooling were studied in this paper. The results show: the shear stress on iron/TiC cermet joint concentrates on the interface tip and the maximum value of shear stress appears on the left tip of iron/TiZrNiCu interface. Positive tensile stress on TiC cermet undersurface concentrates on both sides of TiC cermet and its value decreases during cooling. Negative tensile stress on TiC cermet undersurface concentrates on the center of TiC cermet and its value increases during cooling. Brazing temperature has little effect on the development and maximum value of thermal stress.

Numerical simulation,, Brazing,, TiC cermet,, Iron

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2005年02月22日

【期刊论文】Microstructure and Strength of TiC Cermet/Cast Iron Brazed with Ag-Cu-Zn Filler Metal

冯吉才, L.X. Zhang, J.C. Feng, Z.R. Li and H.J. Liu

,-0001,():

-1年11月30日

摘要

The brazing of TiC cermet to cast iron was carried out at 1223K for 5-30min using Ag-Cu-Zn filler metal. Formation phase, interface structure and shear strength of the joint were investigated. The results show: There occur three formation phases: Cu-base solid solution, FeNi and Ag-base solid solution in TiC cermet/cast iron joint. The amounts of Cu-base solid solution and FeNi increase and the amount of Ag-base solid solution decreases as brazing time increasing. When brazing time is 20min, the highest shear strength of the joint is up to 292.0MPa and the interface structure of the joint can be expressed as TiC cermet/Cu-base solid solution + FeNi/Ag-base solid solution + a little Cu-base solid solution + a little FeNi/Cu-base solid solution + FeNi/cast iron.

TiC cermet, Cast iron, Brazing, Interface structure

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2005年02月22日

【期刊论文】Interface microstructure and formation mechanism of diffusion-bonded joints of TiAl to steel with composite barrien layers and mechanical properties of the joints

冯吉才, Peng He, Jicai Feng, Binggang Zhang, Yiyu Qian

,-0001,():

-1年11月30日

摘要

In this study, intermetallic TiAl and steel 40Cr are diffusion bonded successfully by using a composite barrien layer Ti/V/Cu. The relationship of the bond parameters and tensile strength of the joints was discussed, and the optimum bond parameters were obtained. The reaction products and the interface structures of the joints were investigated by SEM, EPMA and XRD. In this case, a diphase Ti3Al+TiAl layer and a Ti solid solution which enhance the strength of the joint are obtained at the TiAl/Ti interface. Formation mechanism at the interface of TiAl/Ti was propounded. The whole reaction process can be divided into three stages. In the first stage, Ti (ss.Al) layer is formed at the interface TiAl/Ti40Cr. In the second stage, TiAl+ Ti3Al layer are formed adjacent to TiAl, in the mean, the continuous diffusion of Al atoms from TiAl to Ti gives occasion to the formation of Ti3Al. In the last stage, the thickness of each reaction layer increases with bonding time according to a parabolic law. The interface of TiAl/Ti/V/Cu/40Cr was free from intermetallic compounds and other brittle phases, and the strength of the joint was as high as 420MPa, very close to that of the TiAl base. This method gives a reliable bonding of intermetallic TiAl and steel 40Cr.

diffusion bonding,, microstructure,, TiAl

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2005年02月22日

【期刊论文】Ag-Cu-Zn alloy for brazing TiC cermet/steel

冯吉才, Lixia Zhang, Jicai Feng, Baoyou Zhang and Xiangmeng Jing

,-0001,():

-1年11月30日

摘要

The microstructures of the TiC cermet/steel joint brazed with Ag-31Cu-23Zn brazing alloy (1123K, 20min) and Ag-54Cu-33Zn brazing alloy (1123K, 20/25min) were investigated. When the amounts of Cu and Zn increase in the brazing alloy, there are not many Cu-base solid solution stripes and blocks but few Cu-base solid solution blocks occurred in the middle of the brazing alloy.

Brazing alloy, Microstructure, Cermet, Joint

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2005年02月22日

【期刊论文】Interface structure and formation mechanism of diffusion-bonded joints of SiC ceramic to TiAl-based alloy

冯吉才, H. J. Liu, J. C. Feng and Y. Y. Qian

,-0001,():

-1年11月30日

摘要

diffusion bonding, interface, structural ceramic, intermetallic compound

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  • 冯吉才 邀请

    哈尔滨工业大学,黑龙江

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