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【期刊论文】Microstructure and strength of the TiAl/40Cr joint diffusion-bonded with Ti-V-Cu filler metal
冯吉才, Feng Jicai, He Peng, Qian Yiyu, Han Jiecai, Zhang Binggang
,-0001,():
-1年11月30日
In this study, intermetallic TiAl and steel 40Cr are diffusion bonded successfully by using a composite barrien layer Ti/V/Cu. In this case, a diphase Ti3Al+TiAl layer and a Ti solid solution which enhance the strength of the joint are obtained at the TiAl/Ti interface. The interface of TiAl/Ti/V/Cu/40Cr was free from intermetallic compounds and other brittle phases, and the strength of the joint was as high as 420MPa, very close to that of the TiAl base. This method gives a reliable bonding of intermetallic TiAl and steel 40Cr.
diffusion bonding,, microstructure,, TiAl
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【期刊论文】Microstructure and strength of the TiB2 cermet/TiAl joint diffusion bonded with Ni interlayer
冯吉才, Zhuoran LI, Jicai FENG, Jian CAO and Yiyu QIAN
,-0001,():
-1年11月30日
Vacuum diffusion bonding of TiB2 cermet to TiAl-based alloys using Ni interlayer has been carried out at 1123-1323K for 0.6-3.6ks under 80MPa. The effects of joining parameters on the microstructure of the joints and mechanical properties was investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110MPa with bonding temperature T=1223K, bonding time t=1.8ks and bonding pressure P=80MPa.
diffusion bonding,, TiB2 cermet,, TiAl -based alloys
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【期刊论文】Ag-Cu-Zn alloy for brazing TiC cermet/steel
冯吉才, Lixia Zhang, Jicai Feng, Baoyou Zhang and Xiangmeng Jing
,-0001,():
-1年11月30日
The microstructures of the TiC cermet/steel joint brazed with Ag-31Cu-23Zn brazing alloy (1123K, 20min) and Ag-54Cu-33Zn brazing alloy (1123K, 20/25min) were investigated. When the amounts of Cu and Zn increase in the brazing alloy, there are not many Cu-base solid solution stripes and blocks but few Cu-base solid solution blocks occurred in the middle of the brazing alloy.
Brazing alloy, Microstructure, Cermet, Joint
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冯吉才, H. J. Liu, J. C. Feng and Y. Y. Qian
,-0001,():
-1年11月30日
diffusion bonding, interface, structural ceramic, intermetallic compound
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冯吉才, J. Feng, D. Wang, H. Liu and Z. Li
,-0001,():
-1年11月30日
The development of thermal stress during the diffusion bonding of Al2O3 ceramic to Al is analyzed by the finite-element analysis using MARC/MENTAL code. Prior to diffusion bonding, a Cu layer of 0.2mm in thickness is sintered on the ceramic. The results show that shear stress concentration occurs in the ceramic near the corner of Al2O3/Cu interface, and tensile stress concentration occurs near the corners of Al2O3 outer surface during cooling from bonding temperature to room temperature. After tensile stress concentration on the Al2O3 undersurface rises to a certain value, ceramic deforms gradually, resulting in stress beginning to relax. The stress relaxation originates in the stress concentration region of Al2O3 outer surface.
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