Straight copper wire arrays are electrochemically deposited on a silicon substrate without utilizing additives or templates. To suppress the influence of the factors which arouse the ramification of the copper electrodeposit, an ultrathin electrochemical deposition system and an initially homogeneous electric field are used. The width of the copper wires may vary from about 200nm to about 1.5μm depending on the control parameters. The microstructure of the copper wires and their electric resistance after vacuum-annealing at 200℃ are studied. We suggest that this self-organized copper electrodeposition is helpful in gaining an understanding of the formation of dense-branching morphology. It also implies the potential application in microelectronics.

In this paper we report the spontaneous formation of a nanostructured film by electrodeposition from an ultrathin electrolyte layer of CuSO4. The film consists of straight periodic ditches and ridges, which corresponds to the alternating deposition of nanocrystallites of copper and copper plus cuprous oxide, respectively. The periodicity on the film may vary from 100nm to a few hundred nanometers depending on the experimental conditions. In the formation of the periodically nanostructured film, oscillating voltage/current has been observed across the electrodes, and the frequency depends on the pH of the electrolyte and the applied current/voltage. A model based on the coupling of [Cu2+] and [H+] in the electrodeposition is proposed to describe the oscillatory phenomena in our system. The calculated results are in agreement with the experimental observations.

In this paper, we report in detail the studies of a different self-organized copper electrodeposition carried out in an ultrathin layer of CuSO4 electrolyte. On a macroscopic scale, the morphology of the electrodeposit is fingerlike. Microscopically, each fingering branch consists of long, straight copper filaments with periodic corrugated nanostructures. Branching rate of the electrodeposit is significantly decreased, compared with the patterns grown in conventional systems. Detailed information of the growth environment in the ultrathin electrodeposition system is provided, the formation mechanism of the periodic nanostructures on the deposit filaments is explored, and the origin of the significant descent of branching rate of the electrodeposit is discussed.

In this Letter we report a novel self-organized copper electrodeposition in an ultrathin layer of CuSO4 electrolyte. The macroscopic fingering branches of the deposit consist of long copper filaments covered with periodic corrugated nanostructures. The mechanism of the nanostructure formation is explored and the origin of the significant descent of the branching rate in electrodeposition is discussed. We suggest that this growth phenomenon provides deeper insights into the role of diffusion and migration on pattern formation in electrodeposition.