Cu/Ag bimetallic strips were prepared by roll bonding in the temperature range of 293-873K and sinter treating in the temperature range of 523-1073K. The interface peel strength was determined and the peeled surface morphology observed. The high peel strength is obtained from excellent metallurgical joint by atom interdiffusion and matrix recrystallization under the condition of sintering in 523-673K for the bimetallic strips rolled at ambient temperature. Sintering in the temperature range of 873-1073K results in greatly lost peel strength from more voids formed at the interface although some local contacts on the mated surface could melt and merge at 1073K. Low peel strength from poor metallurgical bonding is obtained if the bimetallic strips are only roll bonded at the temperature lower than 623K. The peel strength dramatically loses due to the thick oxide layer existed between the two strip surfaces when the bimetallic strips are roll bonded at excessively high temperature.