Copper-silver bimetallic strips prepared by cold roll cladding have been treated by diffusion annealing in the temperature range 250-800℃. The interface bonding level and the hardness in the matrix copper and silver have been determined and the microstructure in the interface region has been observed. The interface bonding level is essentially improved under the conditions of annealing at both temperatures 400℃ and 800℃. A high diffusion temperature can make the hardness reduce in the strips. Recrystallization just starts in the strips annealed at 250℃ and mainly emerges at 400℃. Annealing above 600℃ can produce the fine grain areas between the interface and the silver matrix. If diffusion treatment induces the recovery, recrystallization or the partial fusion at the bonding interface, the interface bonding level can be enhanced.

The pyrite films with the thickness in 70-600nm were prepared by annealing the iron films with the thickness in 25-150nm at 673K. The structural, optical and electrical characteristics were investigated and the effect of film thickness on film properties was discussed. The pyrite films with different thickness have the optical absorption edges changed in the range 0.93-1.0eV. With increasing in film thickness, electrical resistivity tends to increase and carrier concentration tends to decrease. It is speculated that surface defects in thinner films could play a more important role in the effect on film properties whereas grain boundary defects in thicker films could play a more important role in the effect on film properties.

The crystal structure, crystallite morphology, film composition and absorption properties were investigated for the pyrite films sulfurated from iron films. The pyrite particles nucleate mainly from the transitional phases of iron sulfides formed in the films during 673K sulfurating while the pyrite particles nucleate directly from the iron bisulfides formed in the films during 773K sulfurating. There are higher sulfur contents and more obvious grain propagation in the film sulfurated at 773K than in that sulfurated at 673K. With prolonging sulfuration time at 673K, the optical absorption edge tends to increase and approaches to the ideal value as sulfurated over 20h. Low absorption edges exist in the films sulfurated at 773K.

Iron films deposited by magnetron sputtering were annealed in 80kPa sulfur vapor at 673 and 773K for different time. The structural, optical and electrical properties were determined. Pyrite particles formed at 673K reveal an aggregate morphology evolved from some transitional iron sulfides. With increasing annealing time, the crystallites become distinguishable and the aggregate morphology tends to disappear. The pyrite grains formed at 773K have more uniform distribution and show more obvious propagation with annealing time than those formed at 673K. The values of electrical resistivity of the films prepared at both temperatures and optical absorption edge of the film prepared at 673K significantly increase with annealing time. The films prepared at 673K generally have higher optical absorption edges, lower electrical resistivity, higher carrier concentration and lower charge mobility than those prepared at 773K. Film bulk integrity, residual iron amount and grain boundary area could be considered as the factors responsible for the film property changes with annealing temperature and time.

Cu-6wt%Ag and Cu-6wt%Ag-1wt%Cr microcomposites were prepared by heavy drawing. The morphology of filamentary bundles was observed and the tensile strength and electrical conductivity determined. The effect of Cr addition was discussed according to the changes in the microstructure, strength and conductivity with various draw ratios for both alloys.

The Cu-12wt.%Ag Microcomposite was prepared and the influence of final annealing temperature on the microstructure, mechanical properties and conductivity were investigated. The recrystallization at temperatures lower than 300℃ occurs only within the fibrous phases. The strength, hardness and conductivity notably change with annealing temperatures at 200-400℃. The fibrous structure annealed at lower temperatures maintains higher strength but lower conductivity. The equiaxial structure formed at higher annealing temperatures shows higher conductivity but lower strength. An optimal combination of the strength and conductivity can be obtained by annealing at 300℃ to induce recrystallizing and retain still the filamentary morphology formed in the strong drawing.

制备了Cu-6%Ag及Cu-24%Ag合金铸锭并进行了均匀化处理。通过在合金中添加0.1%混合稀土的方法，研究了稀土元素对高Ag含量和低Ag含量两种合金原始组织的影响。稀土元素可在一定程度上使合金中的共晶体数量增加，细化低Ag含量合金的铸态α基体晶粒，降低高Ag含量合金中被连续网状共晶组织包围的枝晶轴间距。在均匀化退火过程中，稀土元素可明显细化在α基体中析出的次生相，并使共晶组织更趋于分散和向离异共晶形态发展。

The Ag/Cu bimetallic laminates were prepared by rolling bond at different temperature and annealing for different time at 673K and 1023K. Their microstructure, composition and hardness were investigated in the matrix or diffusion zone of the laminates. Dynamic recrystallization induced in rolling process produces the mixture microstructure containing deformed and equiaxial grains. There exists an incomplete recrystallized structure for the laminates annealed at 673K and a polygonal-grain structure for the laminates annealed at 1023K. The grain size in the strip matrixes increases with increasing rolling or annealing temperature. Recrystallization process during rolling or annealing causes the hardness reduction. The reduction is more significant in the Cu side of the laminates rolled at 873K and in the strip matrixes annealed for 0.5h. Faster velocity of Cu atom moving into the Ag side than Ag atom into the Cu side results in a position shifting of Cu concentration curve in the Ag side. The shifting becomes more significant with prolonging annealing time. In the Ag side of the laminates annealed at 1023K, there is a region of fine equiaxial grains along original interface and its width increases with prolonging annealing time. Some Cu-rich particles precipitate along grain boundaries in the fine grain region and can slightly harden the Ag strip component.

Cu/Ag bimetallic strips were prepared by roll bonding in the temperature range of 293-873K and sinter treating in the temperature range of 523-1073K. The interface peel strength was determined and the peeled surface morphology observed. The high peel strength is obtained from excellent metallurgical joint by atom interdiffusion and matrix recrystallization under the condition of sintering in 523-673K for the bimetallic strips rolled at ambient temperature. Sintering in the temperature range of 873-1073K results in greatly lost peel strength from more voids formed at the interface although some local contacts on the mated surface could melt and merge at 1073K. Low peel strength from poor metallurgical bonding is obtained if the bimetallic strips are only roll bonded at the temperature lower than 623K. The peel strength dramatically loses due to the thick oxide layer existed between the two strip surfaces when the bimetallic strips are roll bonded at excessively high temperature.

A parameter, notch insensitivity factor, has been derived in order to assess the stress concentration sensitivity of Al-Li based alloys. The effect of impurities and Ce element on the stress concentration sensitivity of Al-Li-Cu-Zr, Al-Li-Cu-Mg-Zr and Al-Li-Mg-Zr alloy sheets has been investigated and the dependence of the stress concentration sensitivity on the mechanical properties and microstructural parameters discussed. Deleterious impurities can enhance the stress concentration sensitivity especially for the conventional impurities in Al-Li-Cu-Mg-Zr alloy and for the alkali metal impurities in Al-Li-Cu-Zr alloy. Suitable Ce microalloying can reduce the stress concentration sensitivity to a certain degree and the benefit is more significant to the Al-Li-Cu-Zr alloy rich in the conventional impurities. When varying the composition systems, impurity kinds, impurity content, Ce element concentration and heat treating process makes the yield strength increase, fracture toughness decrease, partial recrystallised volume rise and grain size increase, the stress concentration sensitivity usually tends to increase. A special attention should be paid to the practical application of Al-Li alloys because there generally is high stress concentration sensitivity for the alloys as compared with conventional aluminum alloys.