介绍了作为近年来国际上研究热点之一的智能材料和智能结构的概念、原理和研究动态。并对今后的发展、应用前景进行了讨论。

利用基于关联维数的相位随机化的替代数据算法,对不同键合压力下超声换能系统中换能杆末端轴向振动的实测数据进行正确替代,并用非线性动力学的理论来检验其是否具有非线性。通过实验对所测振动时间序列的关联维数进行计算,结果表明在实际键合过程中,不同键合压力下变幅杆末端轴向振动都具有非线性成分。这有利于更好地认识超声引线键合换能系统,并为进一步利用非线性时间序列分析方法研究引线键合过程中的复杂振动提供了深入分析的科学手段。

The authors demonstrate that the ultrasonic vibration in flip chip FC bonding results in the generation of dislocations, and the atomic diffusion can be activated more easily along the dislocation lines which perform the fast diffusion channels, thus the dislocation diffusion is probably more prominent than the body diffusion during ultrasonic bonding. To minimize the intermetallic compound layer, the effectiveness of a different bonding approach is confirmed. Furthermore, an experiment-based mode of ultrasonic energy conversion was found that the ratio of up interface to down interface in ultrasonic FC bonding was about 2.3:1.

使用红外测温仪对加热台及微型叠层芯片表面进行测试，对所获得的温度数据进行分析建模。发现叠层芯片结构表面悬臂区域和非悬臂区域的温度存在差异，并讨论其原因。进一步对不同区域的温度曲线进行拟合，发现Logistic模型可用于叠层芯片结构测温数据的建模和阐释其温升机制缘由。实验结果有助于叠层芯片悬臂键合动力学机理的研究。

Microelectronics packaging has been developing rapidly due to the demands for faster, lighter and smaller products. Printed circuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved development of the structural integrity models for predicting lifetime under thermal environmental exposure; however the theoretical models need verification by the experiment. The objective of the current work is the development of an optical system and testing procedure for evaluation of the thermal deformation of PCBs in the wide temperature range. Due to the special requirements of the specimen and test condition, the existing technologies and setups were updated and modified. The discussions on optical methods, thermal loading chambers, and image data processing are presented. The proposed technique and specially designed test bench were employed successfully to measure the thermal deformations of PCB in the 40 C to +160 C temperature range. The video-based moir!e interferometry was used for generating, capturing and analysis of the fringe patterns. The obtained information yields the needed coefficients of thermal expansion (CTE) for tested PCBs.